Electrodeposition of copper
    1.
    发明授权
    Electrodeposition of copper 失效
    铜的电沉积

    公开(公告)号:US3798138A

    公开(公告)日:1974-03-19

    申请号:US3798138D

    申请日:1971-07-21

    Applicant: LEA RONAL INC

    Inventor: OSTROW B NOBEL F

    CPC classification number: C25D3/38

    Abstract: COOPER IS ELECTRODEPOSITED FROM AN AQUEOUS ACID PLATING BATH OR SOLUTION CONTAINING AT LEASTT ONE COPPER SALT, A HETEROCYCLIC SULPHUR-NITROGEN ORGANIC COMPOUND, SUCH AS WATER SOLUBLE DERIVATIVES OF 2-THIAZOLIDINETHIONES, 2-IMIDAZOLIDINETIONES OR THEIR REACTION PRODUCTS WITH ALKYL ALDEHYDES OR DIALDEHYDES, AND A WATER SOLUBLE BRIGHTENER CONTAINING A CARBON-SULPHUR GROUP IN WHICH THE CARBON ATOM IS ATTACHED TO AT LEAST ONE OTHER HETERO-ATOM, SUCH AS SULPHUR OR NITROGEN.

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