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    Electrolytes for the electrolytic deposition of zinc
    3.
    发明授权
    Electrolytes for the electrolytic deposition of zinc 失效
    用于电解沉积锌的电解液

    公开(公告)号：US3869358A

    公开(公告)日：1975-03-04

    申请号：US41281773

    申请日：1973-11-05

    Applicant: LEA RONAL INC

    Inventor： NOBEL FRED I ,  OSTROW BARNET D

    IPC: C25D3/22 ,  C25D3/24 ,  C23B5/46 ,  C23B5/10

    CPC classification number: C25D3/24 ,  C25D3/22

    Abstract: An aqueous alkaline zinc bath is used for electroplating bright metallic zinc deposits on metal substrates said plating bath containing less than about 2 oz./gal. of cyanide therein, and comprising an aqueous alkaline solution having dissolved therein a soluble zinc compound capable of being plated by electrolytic deposition and a water soluble reaction product of an amine and an epihalohydrin containing recurring tertiary and/or quaternary amine groups and having a molecular weight above about 250 in an amount from at least about 0.1 gm./liter.

    Abstract translation: 电镀碱性锌浴用于在金属基底上电镀明亮的金属锌沉积物，所述镀浴含有小于约2盎司/ 的氰化物，并且包含其中溶解有能够通过电解沉积进行镀覆的可溶性锌化合物的水性碱性溶液和含有重复的叔和/或季胺基团并具有分子量的胺和表卤代醇的水溶性反应产物 高于约250，至少约0.1gm /升。

    Cyanide-free electroplating
    4.
    发明授权
    Cyanide-free electroplating 失效
    无氰电镀

    公开(公告)号：US3833486A

    公开(公告)日：1974-09-03

    申请号：US34504173

    申请日：1973-03-26

    Applicant: LEA RONAL INC

    Inventor： NOBEL F ,  YOEN L

    IPC: C25D3/02 ,  C25D3/38 ,  C23B5/02 ,  C23B5/18 ,  C23B5/46

    CPC classification number: C25D3/02 ,  C25D3/38

    Abstract: Improved cyanide-free aqueous electroplating baths for plating metals, the baths containing water soluble phosphonate chelating agents combined with at least one chelatable metal ion and containing as an additive at least one strong oxidizing agent, and electroplating processes employing said baths. Additional materials may also be added for further improvements.

    Abstract translation: 用于电镀金属的改进的无氰化合物电镀浴，包含与至少一种螯合金属离子结合并含有至少一种强氧化剂的添加剂的水溶性膦酸盐螯合剂的浴和使用所述浴的电镀方法。 还可以添加另外的材料以进一步改进。

    Electrodeposition of copper from acidic baths
    5.
    发明授权
    Electrodeposition of copper from acidic baths 失效
    铜从酸性电池的电沉积

    公开(公告)号：US3725220A

    公开(公告)日：1973-04-03

    申请号：US3725220D

    申请日：1972-04-27

    Applicant: LEA RONAL INC

    Inventor： KESSLER R ,  NOBEL F

    IPC: C25D3/38 ,  C23B5/20 ,  C23B5/46

    CPC classification number: C25D3/38

    Abstract: An acid copper plating bath which contains a copper metal salt and a minor amount of a sulfoniumalkanesulfonate or sulfoniumalkanecarboxylate as a brightening agent. Illustrative sulfonium compounds are N-cyclohexyl-2-benzothiazol sulfonium-1propanesulfonate, bis (dimethylthiocarbamyl) sulfonium-1propanesulfonate, and bis (dimethylthiocarbamyl) sulfonium-1propanecarboxylate. Preferred amounts of the sulfonium compounds range from about 0.001 to 1.0 grams per liter. The use of such acid copper plating baths in the electrodeposition of copper metal is also disclosed.

    Abstract translation: 一种含有铜金属盐和少量的磺基链烷磺酸锍或硫代锍羧酸盐作为增亮剂的酸性镀铜浴。 示例性的锍化合物是N-环己基-2-苯并噻唑锍-1-丙磺酸盐，双（二甲基硫代氨基甲酰基）锍-1-丙磺酸盐和双（二甲基硫代氨基甲酰基）锍-1-丙烷羧酸盐。 锍化合物的优选量为约0.001至1.0克/升。 还公开了在铜金属的电沉积中使用这种酸性电镀浴。

    Electrodeposition of copper
    6.
    发明授权
    Electrodeposition of copper 失效
    铜的电沉积

    公开(公告)号：US3798138A

    公开(公告)日：1974-03-19

    申请号：US3798138D

    申请日：1971-07-21

    Applicant: LEA RONAL INC

    Inventor： OSTROW B ,  NOBEL F

    IPC: C25D3/38 ,  C23B5/20 ,  C23B5/46

    CPC classification number: C25D3/38

    Abstract: COOPER IS ELECTRODEPOSITED FROM AN AQUEOUS ACID PLATING BATH OR SOLUTION CONTAINING AT LEASTT ONE COPPER SALT, A HETEROCYCLIC SULPHUR-NITROGEN ORGANIC COMPOUND, SUCH AS WATER SOLUBLE DERIVATIVES OF 2-THIAZOLIDINETHIONES, 2-IMIDAZOLIDINETIONES OR THEIR REACTION PRODUCTS WITH ALKYL ALDEHYDES OR DIALDEHYDES, AND A WATER SOLUBLE BRIGHTENER CONTAINING A CARBON-SULPHUR GROUP IN WHICH THE CARBON ATOM IS ATTACHED TO AT LEAST ONE OTHER HETERO-ATOM, SUCH AS SULPHUR OR NITROGEN.

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