公开(公告)号：US10134993B2

公开(公告)日：2018-11-20

申请号：US13929296

申请日：2013-06-27

Applicant: LG DISPLAY CO., LTD.

Inventor： Yeon Keun Lee ,  Jae Min Moon ,  Joon Koo Kang ,  Mun Kyu Joo ,  Kyoung Sik Moon ,  Seong Su Jang

IPC: H01L51/00 ,  G02B5/02 ,  H01L51/52

Abstract: Provided is a substrate for an organic light emitting diode including a base substrate, a high refractive scattering layer formed on the base substrate, and having a scattering particle scattering light in a high refractive material, and an adhesive layer formed between the base substrate and the high refractive scattering layer to laminate the base substrate with the high refractive scattering layer, wherein the high refractive scattering layer has a structure in which the scattering particle is immersed in the high refractive material, an average thickness of the high refractive scattering layer is smaller than an average diameter of the scattering particle, a surface of the high refractive scattering layer laminated with the base substrate by the adhesive layer has unevenness formed by the scattering particle, the opposite surface of the high refractive scattering layer laminated with the base substrate by the adhesive layer has a planarized surface, and a method for manufacturing the same. The substrate may have an excellent degree of planarization and improved light extraction efficiency without degradation in performance of the diode, and low process and material costs and mass-production of the substrate may be easily achieved.

公开(公告)号：US09472598B2

公开(公告)日：2016-10-18

申请号：US14099648

申请日：2013-12-06

Applicant: LG DISPLAY CO., LTD.

Inventor： Yeon Keun Lee ,  Kyoung Sik Moon ,  Seong Su Jang

IPC: H01L27/32

CPC classification number: H01L27/3204 ,  H01L2251/5361

Abstract: The present invention relates to an organic light-emitting element comprising a first electrode, a second electrode, and an organic layer interposed between said first electrode and said second electrode, and to a light-emitting device including the same, wherein in the organic light-emitting element, a connection electrode for electrically connecting two or more elements in serial is formed on a non-light-emitting surface of said organic light-emitting element. The invention can electrically connect a plurality of organic light-emitting elements easily, and can be implemented as a large-scale lighting or display device or the like.

Abstract translation: 本发明涉及一种有机发光元件，其包括第一电极，第二电极和介于所述第一电极和所述第二电极之间的有机层，以及涉及包含该有机发光元件的发光器件，其中在有机光 在所述有机发光元件的非发光表面上形成用于串联连接两个或更多个元件的连接电极。 本发明可以容易地电连接多个有机发光元件，并且可以实现为大型照明或显示装置等。

公开(公告)号：US09905764B2

公开(公告)日：2018-02-27

申请号：US13928161

申请日：2013-06-26

Applicant: LG DISPLAY CO., LTD.

Inventor： Yeon Keun Lee ,  Jae Min Moon ,  Joon Koo Kang ,  Mun Kyu Joo ,  Kyoung Sik Moon ,  Seong Su Jang

IPC: H01L51/00 ,  G02B5/00 ,  H01L51/52 ,  G02B5/02

CPC classification number: H01L51/0024 ,  G02B5/0242 ,  G02B5/0278 ,  H01L51/0096 ,  H01L51/5268 ,  H01L51/5275 ,  Y02E10/549

Abstract: Provided is a substrate for an organic light emitting diode including a base substrate, a high refractive scattering layer formed on the base substrate, and having a scattering particle scattering light in a high refractive material, and an adhesive layer formed between the base substrate and the high refractive scattering layer to laminate the base substrate with the high refractive scattering layer, wherein the high refractive scattering layer has a structure in which the scattering particle is immersed in the high refractive material, an average thickness of the high refractive scattering layer is smaller than an average diameter of the scattering particle, a surface of the high refractive scattering layer laminated with the base substrate by the adhesive layer has unevenness formed by the scattering particle, the opposite surface of the high refractive scattering layer laminated with the base substrate by the adhesive layer has a planarized surface, and a method for manufacturing the same. The substrate may have an excellent degree of planarization and improved light extraction efficiency without degradation in performance of the diode, and low process and material costs and mass-production of the substrate may be easily achieved.