公开(公告)号：US20190198438A1

公开(公告)日：2019-06-27

申请号：US16215331

申请日：2018-12-10

Applicant: LG Display Co., Ltd.

Inventor： Daekyung KIM ,  Wansik LIM ,  Jaesung JEON ,  Ri YU ,  Cheolho LEE ,  Joohye KANG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A chip on film according to the present disclosure includes a base film, a plurality of signal wirings on an upper surface and a lower surface of the base film to transmit a signal in two signal paths, a driving unit on one surface of the upper surface and the lower surface of the base film, a first pad and a second pad on one surface of the upper surface and the lower surface of the base film, and a plurality of through holes between the first pad and the second pad and electrically connect to the signal wiring.

公开(公告)号：US20210202531A1

公开(公告)日：2021-07-01

申请号：US17126995

申请日：2020-12-18

Applicant: LG Display Co., Ltd.

Inventor： Cheolho LEE ,  Sunhwan KIM

IPC: H01L27/12 ,  H01L23/00

Abstract: A display device includes a display panel including a display area and a non-display area, a first output pad set, a second output pad set, and a buffer pad set that are disposed in the non-display area, and a path change circuit. In an exemplary embodiment, the path change circuit is configured to change a signal delivery path such that a signal delivered through the first output pad set or the second output pad set is delivered through the buffer pad set, when an enable signal is input.