公开(公告)号：US20190198438A1

公开(公告)日：2019-06-27

申请号：US16215331

申请日：2018-12-10

Applicant: LG Display Co., Ltd.

Inventor： Daekyung KIM ,  Wansik LIM ,  Jaesung JEON ,  Ri YU ,  Cheolho LEE ,  Joohye KANG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A chip on film according to the present disclosure includes a base film, a plurality of signal wirings on an upper surface and a lower surface of the base film to transmit a signal in two signal paths, a driving unit on one surface of the upper surface and the lower surface of the base film, a first pad and a second pad on one surface of the upper surface and the lower surface of the base film, and a plurality of through holes between the first pad and the second pad and electrically connect to the signal wiring.

公开(公告)号：US20190206295A1

公开(公告)日：2019-07-04

申请号：US16155705

申请日：2018-10-09

Applicant: LG Display Co., Ltd.

Inventor： Jaesung JEON ,  Daekyung KIM ,  Eunbyul KIM

IPC: G09G3/20 ,  H01L27/12 ,  H05K1/18 ,  H05K3/32 ,  H01L23/498 ,  H01L23/00

Abstract: Disclosed herein is a chip-on-film including: a base film; a driver mounted on one of upper and lower surfaces of the base film; and at least one pad group, which includes signal wiring lines disposed on the upper and lower surfaces of the base film and transmitting signals via two paths, a first pad and a second pad disposed on one of the upper and lower surfaces of the base film, and a plurality of through-holes disposed between the first pad and the second pad and electrically connecting the signal wiring lines to each other, wherein the first pad and the second pad are separated a predetermined distance from each other in a width direction of the base film, and each of the first pad and the second pad is obliquely arranged in plural in a longitudinal direction of the base film.