公开(公告)号：US20190187519A1

公开(公告)日：2019-06-20

申请号：US16223715

申请日：2018-12-18

Applicant: LG Display Co., Ltd.

Inventor： Dong-Hwi KIM ,  Ki-Seong KIM ,  Ji-Seok YANG

IPC: G02F1/1335

Abstract: A backlight unit includes a diffusion plate, wherein the diffusion plate includes a first region along edges of the diffusion plate, and a second region surrounded by the first region, and wherein a thickness of the first region decreases toward an outer side direction of the diffusion plate.

公开(公告)号：US20190137825A1

公开(公告)日：2019-05-09

申请号：US16170381

申请日：2018-10-25

Applicant: LG Display Co., Ltd.

Inventor： Il-Soo KIM ,  Dong-Hwi KIM ,  Ki-Seong KIM

IPC: G02F1/1335 ,  H01L25/13 ,  H05K1/18

Abstract: A backlight unit includes: a plurality of light emitting diode (LED) packages on a top surface of a circuit board; an encapsulation layer located on the circuit board and covering the plurality of LED packages; and an integrated pattern sheet on the encapsulation layer, the integrated pattern sheet including: a base layer; a plurality of lens patterns at a top surface of the base layer and respectively corresponding to the plurality of LED packages; and hollow cavity particles at a bottom surface of the base layer and at a region between the plurality of LED packages.

公开(公告)号：US20190094616A1

公开(公告)日：2019-03-28

申请号：US16140817

申请日：2018-09-25

Applicant: LG Display Co., Ltd.

Inventor： Dong-Hwi KIM ,  Ki-Seong KIM ,  Hyun-Min PARK ,  Kyu-Hwan LEE

IPC: G02F1/1335 ,  G02F1/1345 ,  F21V8/00

Abstract: A liquid crystal display device includes a liquid crystal panel and a backlight unit under the liquid crystal panel and including a circuit board; a plurality of LED packages mounted on the circuit board; a partition wall on the circuit board and surrounding at least one LED package; an encapsulation member covering the plurality of LED packages and the partition wall; and a reflective pattern sheet over the encapsulation member and including a plurality of first reflective patterns corresponding to the plurality of LED packages, respectively, wherein a height of the partition wall is equal to or greater than a height of the at least one LED package and smaller than or equal to a thickness of the encapsulation member.