BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20190094619A1

    公开(公告)日:2019-03-28

    申请号:US16135838

    申请日:2018-09-19

    Abstract: A backlight unit includes a plurality of light emitting diode (LED) packages on a top surface of a circuit board, an encapsulation member located on the circuit board and covering the plurality of LED packages, and an integrated pattern sheet on the encapsulation member. The integrated pattern sheet includes a base layer, a plurality of reflective patterns at a bottom surface of the base layer and respectively corresponding to the plurality of LED packages, and a plurality of diffusion patterns at a top surface of the base layer, wherein the reflective patterns are configured with a relational expression of c+(t2−t1)*tan {(sin−1(1/n)}>d

    BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20190094616A1

    公开(公告)日:2019-03-28

    申请号:US16140817

    申请日:2018-09-25

    Abstract: A liquid crystal display device includes a liquid crystal panel and a backlight unit under the liquid crystal panel and including a circuit board; a plurality of LED packages mounted on the circuit board; a partition wall on the circuit board and surrounding at least one LED package; an encapsulation member covering the plurality of LED packages and the partition wall; and a reflective pattern sheet over the encapsulation member and including a plurality of first reflective patterns corresponding to the plurality of LED packages, respectively, wherein a height of the partition wall is equal to or greater than a height of the at least one LED package and smaller than or equal to a thickness of the encapsulation member.

    BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20190137825A1

    公开(公告)日:2019-05-09

    申请号:US16170381

    申请日:2018-10-25

    Abstract: A backlight unit includes: a plurality of light emitting diode (LED) packages on a top surface of a circuit board; an encapsulation layer located on the circuit board and covering the plurality of LED packages; and an integrated pattern sheet on the encapsulation layer, the integrated pattern sheet including: a base layer; a plurality of lens patterns at a top surface of the base layer and respectively corresponding to the plurality of LED packages; and hollow cavity particles at a bottom surface of the base layer and at a region between the plurality of LED packages.

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