公开(公告)号：US20250056925A1

公开(公告)日：2025-02-13

申请号：US18745483

申请日：2024-06-17

Applicant: LG Display Co., Ltd.

Inventor： Dojin Kim ,  Eunjeong Shin

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/62

Abstract: Provided is a display device. The display device comprises a substrate including an active area in which a plurality of sub pixels is disposed and a non-active area. The display device comprises a plurality of transistors disposed in each of the plurality of sub pixels on the substrate. The display device comprises a plurality of light emitting diodes disposed in each of the plurality of sub pixels on the substrate. The display device comprises a plurality of first alignment keys disposed on the substrate. The display device comprises an insulating layer which includes a plurality of inorganic insulating layers and a plurality of organic insulating layers disposed on the substrate. In an area which overlaps the plurality of first alignment keys, the plurality of organic insulating layers is disposed on the plurality of inorganic insulating layers.

公开(公告)号：US20240379898A1

公开(公告)日：2024-11-14

申请号：US18647168

申请日：2024-04-26

Applicant: LG Display Co, Ltd.

Inventor： ChungHwan An ,  Eunjeong Shin

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of manufacturing a display device is disclosed. The method comprises aligning a first wafer with a donor substrate, the first wafer including a first light emitting diodes (LEDs), first alignment keys, and second alignment keys. The method comprises transferring the first LEDs and a portion of the second alignment keys included in the first wafer onto the donor substrate. The method comprises aligning a second wafer with the donor substrate, the second wafer including second LEDs, first alignment keys, second alignment keys, and third alignment keys of the second wafer. The second wafer is aligned with the donor substrate by aligning the portion of the second alignment keys of the first wafer that are disposed on the donor substrate with the third alignment keys of the second wafer.

公开(公告)号：US11107800B2

公开(公告)日：2021-08-31

申请号：US16727743

申请日：2019-12-26

Applicant: LG Display Co., Ltd.

Inventor： HyeonHo Son ,  HanSaem Kang ,  Bogyun Chung ,  Sungeun Bae ,  HyungJu Park ,  Eunjeong Shin ,  Jeenmoon Yang

IPC: H01L25/16 ,  H01L27/12

Abstract: A display device can include a substrate on which a semiconductor element and a common electrode are disposed; a light emitting diode which is disposed on the substrate and includes an n-type layer, a light emitting layer, and a p-type layer; an insulating layer disposed on the substrate and the light emitting diode; and a first connecting electrode which is connected to the light emitting diode and the semiconductor element. Accordingly, it is possible to minimize defects which can be caused during a process of disposing the light emitting diode on the substrate.