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公开(公告)号：US20220018580A1
公开(公告)日：2022-01-20
申请号：US17356951
申请日：2021-06-24
Applicant: LG ELECTRONICS INC.
Inventor： Minsoo KIM , Eunjun CHO , Pilhyun YOON , Jihyeong RYU , Youngmin LEE , Hojin SEO
Abstract: A heat pump is provided that may include an indoor unit including an indoor heat exchanger; an outdoor unit including an outdoor heat exchanger and a compressor that compresses a refrigerant; a housing that forms an outer shape of the outdoor unit and provides an internal space in which the outdoor heat exchanger and the compressor are disposed; a partition wall that is disposed in the internal space of the housing, and divides the internal space into a flow path space in which the outdoor heat exchanger is disposed and a cycle space in which the compressor is disposed; an outdoor fan disposed in the flow path space to cause an air flow; and a controller that controls an operation of the compressor and the outdoor fan. The housing may include a hole that communicates with the cycle space, and the partition wall may include a barrier hole that communicates the flow path space and the cycle space.
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Patent Agency Ranking
公开(公告)号：US20210262709A1
公开(公告)日：2021-08-26
申请号：US17184156
申请日：2021-02-24
Applicant: LG ELECTRONICS INC.
Inventor： Jihyeong RYU , Eunjun CHO , Minsoo KIM , Youngmin LEE , Hojin SEO
Abstract: A heat pump may include a compressor configured to compress a refrigerant, a first temperature sensor configured to detect an outdoor temperature, a second temperature sensor provided in heating pipes connected to a heating device, and a controller. Based on a first sensing value of the first temperature sensor, the controller may be configured to control a compressor, control power to a boiler, and/or calculate an expected efficiency of the heat pump. Based on the expected efficiency and/or a second sensing value of a second temperature sensor, the controller may be configured to control power to the boiler.
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公开(公告)号：US20210262708A1
公开(公告)日：2021-08-26
申请号：US17184059
申请日：2021-02-24
Applicant: LG ELECTRONICS INC.
Inventor： Jihyeong RYU , Eunjun CHO , Minsoo KIM , Youngmin LEE , Hojin SEO
Abstract: A heat pump may include a compressor configured to compress a refrigerant, a first temperature sensor configured to detect an outdoor temperature, a second temperature sensor provided in heating pipes connected to a heating device that performs indoor heating and configured to detect a temperature of fluid flowing through the heating pipes, an outdoor heat exchanger configured to perform heat exchange between outdoor air and a refrigerant, a third temperature sensor configured to detect a temperature of the outdoor heat exchanger, and a controller. The controller may be configured to: control power to a boiler and/or to the compressor based on sensing values of the first, second, and third temperature sensors, calculate an expected efficiency of the heat pump based on the sensing value of the first temperature sensor and an initial target temperature, and control power to the boiler based on the expected efficiency.
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公开(公告)号：US20230288105A1
公开(公告)日：2023-09-14
申请号：US18015569
申请日：2021-07-12
Applicant: LG ELECTRONICS INC.
Inventor： Jihyeong RYU , Eunjun CHO , Minsoo KIM , Youngmin LEE , Hojin SEO
CPC classification number: F25B25/005 , F24D3/1008 , F24D3/18 , F25B49/02 , F25B2500/24 , F25B2700/19
Abstract: The present disclosure relates to a heat pump and a control method thereof, and to a heat pump including an outdoor unit including a compressor for compressing a first refrigerant, a first outdoor heat exchanger for exchanging heat between the first refrigerant and outdoor air, an expansion mechanism for expanding the first refrigerant, and a second outdoor heat exchanger for exchanging heat between the first refrigerant and a second refrigerant; a first refrigerant pipe which connects the compressor, the first outdoor heat exchanger, and the expansion mechanism, and through which the first refrigerant flows; a pressure sensor disposed in the first refrigerant pipe; a second refrigerant pipe which is connected to the second outdoor heat exchanger, and through which the second refrigerant flows; an indoor heat exchanger which is disposed in the second refrigerant pipe, and exchanges heat between indoor air and the second refrigerant; and a controller configured to determine a supply of the second refrigerant by determining a flow rate of the second refrigerant based on surging occurred in a pressure of the first refrigerant measured by the pressure sensor, so that the flow rate of the second refrigerant flowing through the second refrigerant pipe is determined only by the pressure value of the first refrigerant measured by the pressure sensor disposed in the first pipe, thereby determining the flow rate of the second refrigerant without a separate flow sensor, and a control method thereof.
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公开(公告)号：US20230077481A1
公开(公告)日：2023-03-16
申请号：US17801956
申请日：2021-02-24
Applicant: LG ELECTRONICS INC.
Inventor： Seongho HONG , Eunjun CHO , Hojin SEO
IPC: F24F11/36
Abstract: A heat pump including a housing configured to be disposed outdoors; a compressor that compresses a refrigerant; a fluid refrigerant heat exchanger configured to perform heat exchange between the refrigerant and a fluid; an outdoor heat exchanger configured to perform heat exchange between the refrigerant and outdoor air; a pressure sensor configured to detect a pressure of the refrigerant flowing between the compressor and the fluid refrigerant heat exchanger; a first shut-off valve disposed in a pipe connected to a discharge of the compressor; a second shut-off valve disposed between the outdoor heat exchanger and the compressor; and a controller configured to: determine whether the refrigerant leaks, control the first shut-off valve to be closed, when the refrigerant leaks, and control the second shutoff valve to be closed, when the pressure sensed by the pressure sensor is less than a predetermined reference pressure.
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公开(公告)号：US20220404076A1
公开(公告)日：2022-12-22
申请号：US17836133
申请日：2022-06-09
Applicant: LG ELECTRONICS INC
Inventor： Eunjun CHO , Minsoo KIM , Hojin SEO , Dongkeun YANG
Abstract: A device is provided that may include a compressor configured to compress a refrigerant, a condenser configured to condense the compressed refrigerant, an expander configured to expand the refrigerant condensed by the condenser, an evaporator configured to evaporate the refrigerant expanded by the expander, a separation mechanism connected to an outlet pipe of the evaporator to separate liquid refrigerant and gaseous refrigerant discharged from the evaporator, a bypass pipe to guide the gaseous refrigerant separated from the liquid refrigerant to the compressor, a first pipe connected to the separation mechanism and through which the liquid refrigerant discharged from the separation mechanism flows, an accumulator connected to the first pipe to separate the gaseous refrigerant, which is not separated from the liquid refrigerant by the separation mechanism, from the liquid refrigerant and discharge the separated gaseous refrigerant, and a second pipe configured to guide the gaseous refrigerant discharged from the accumulator to the compressor.
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