Induction heating device having improved switch stress reduction structure

    公开(公告)号:US11304267B2

    公开(公告)日:2022-04-12

    申请号:US16353655

    申请日:2019-03-14

    Abstract: An induction heating device includes first and second working coils connected electrically in parallel, an inverter unit configured to switch at least one of the first working coil or the second working coil, an inverter driving unit connected to the inverter unit; a first semiconductor switch connected to the first working coil, a first semiconductor switch driving unit connected to the first semiconductor switch, an over-current protection unit connected to the first semiconductor switch, configured to generate information based on a current that flows in the first semiconductor switch, and configured to, based on the information, determine whether to turn off the inverter driving unit, and a control unit that is configured to receive the information, and determine, based on the information, whether to block a pulse signal to the inverter driving unit and whether to turn off the first semiconductor switch driving unit.

    Support structure for object to be heated

    公开(公告)号:US11265972B2

    公开(公告)日:2022-03-01

    申请号:US16145403

    申请日:2018-09-28

    Abstract: Disclosed is a support structure for an induction heating device that includes a working coil configured to heat an object. The support structure includes: a housing including an upper surface that is recessed do inward and that is configured to seat the object; a repeating coil that is located inside of the housing, that is configured to generate magnetic induction or magnetic resonance with the working coil, and that is configured to heat the object on the upper surface of the housing based on magnetic induction or magnetic resonance with the working coil; and a compensation capacitor located inside of the housing and connected to the repeating coil, where the compensation capacitor is configured to control output of the repeating coil.

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