公开(公告)号：USRE49131E1

公开(公告)日：2022-07-12

申请号：US16797864

申请日：2020-02-21

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F39/00 ,  D06F58/20 ,  D06F25/00 ,  D06F58/10

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.

公开(公告)号：USRE49371E1

公开(公告)日：2023-01-17

申请号：US16797762

申请日：2020-02-21

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F58/20 ,  D06F25/00 ,  D06F39/00 ,  D06F58/10

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.

公开(公告)号：USRE49173E1

公开(公告)日：2022-08-16

申请号：US16797892

申请日：2020-02-21

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F39/00 ,  D06F58/20 ,  D06F25/00 ,  D06F58/10

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.

公开(公告)号：USRE49282E1

公开(公告)日：2022-11-08

申请号：US16797187

申请日：2020-02-21

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F58/20 ,  D06F39/00 ,  D06F58/10 ,  D06F25/00

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.

公开(公告)号：USRE48900E1

公开(公告)日：2022-01-25

申请号：US16797836

申请日：2020-02-21

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F39/00 ,  D06F39/14 ,  D06F58/20 ,  D06F25/00 ,  D06F58/10

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.

公开(公告)号：US10138586B2

公开(公告)日：2018-11-27

申请号：US14972454

申请日：2015-12-17

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F39/00 ,  D06F58/20 ,  D06F39/04 ,  D06F39/14 ,  D06F58/28

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.

公开(公告)号：USRE50220E1

公开(公告)日：2024-11-26

申请号：US17956038

申请日：2022-09-29

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F39/00 ,  D06F39/04 ,  D06F39/14 ,  D06F58/20 ,  D06F25/00 ,  D06F39/40 ,  D06F58/10

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.

公开(公告)号：USRE49328E1

公开(公告)日：2022-12-06

申请号：US16797725

申请日：2020-02-21

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun Ahn ,  Youngjin Doh ,  Sunyong Kim

IPC: D06F58/20 ,  D06F25/00 ,  D06F39/00 ,  D06F58/10

Abstract: A fabric treating apparatus includes a casing that includes a treating chamber and a machinery room that is located below the treating chamber. The fabric treating apparatus further includes a base that is located at a bottom of the machinery room. The fabric treating apparatus further includes a heat pump module that is configured to condition air supplied to the treating chamber. The fabric treating apparatus further includes at least one supporter that is configured to support the heat pump module and that defines a space between the base and the heat pump module. The fabric treating apparatus further includes a steam generating module that is located in the space and that is configured to generate steam and supply steam to the treating chamber. The fabric treating apparatus further includes a controller that is configured to control at least one of the heat pump module or the steam generating module.