公开(公告)号：US20240421133A1

公开(公告)日：2024-12-19

申请号：US18292714

申请日：2022-06-07

Applicant: LG ELECTRONICS INC.

Inventor： Daewoon HONG ,  Taehyun KIM ,  Dahye KIM ,  Jaesang MIN ,  Sangtae PARK

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: The present invention relates to a light emitting element package manufacturing method and a display apparatus manufacturing method. According to an embodiment of the present invention, a light emitting element package manufacturing method may be provided, the method comprising the steps of: providing a substrate having, on one surface, a plurality of first pads and a plurality of second pads; arranging a plurality of light emitting elements on the substrate so that the light emitting elements are electrically connected to the plurality of second pads, respectively; arranging a plurality of joint parts on the one surface of the substrate so that the joint parts are electrically connected to the plurality of first pads, respectively; and sawing the substrate so as to form a light source that has at least one of the plurality of light emitting elements.

公开(公告)号：US20210057372A1

公开(公告)日：2021-02-25

申请号：US16982431

申请日：2018-10-19

Applicant: LG Electronics Inc.

Inventor： Heoncheol OH ,  Jaesang MIN ,  Yonghee PARK ,  Jinwoo LEE ,  Heejin CHO

IPC: H01L23/00 ,  H01L23/373 ,  H02M7/00

Abstract: A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. (New) The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.

公开(公告)号：US20240030177A1

公开(公告)日：2024-01-25

申请号：US18375761

申请日：2023-10-02

Applicant: LG Electronics Inc.

Inventor： Heoncheol OH ,  Jaesang MIN ,  Yonghee PARK ,  Jinwoo LEE ,  Heejin CHO

IPC: H01L23/00 ,  H01L23/373 ,  H02M7/00

CPC classification number: H01L24/32 ,  H01L23/3735 ,  H02M7/003

Abstract: A power module includes: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, where the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.