公开(公告)号：US11939439B2

公开(公告)日：2024-03-26

申请号：US17536604

申请日：2021-11-29

Applicant: LG ELECTRONICS INC.

Inventor： Junseok Lee ,  Dongjoo You ,  Seongmoon Cho ,  Jinkyun Lee ,  Seungsoo Choi

IPC: C08J5/18 ,  C08K3/36 ,  C08K7/26

CPC classification number: C08J5/18 ,  C08K3/36 ,  C08K7/26 ,  C08J2327/18 ,  C08J2379/08 ,  C08K2201/002

Abstract: The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.