公开(公告)号：US20240251214A1

公开(公告)日：2024-07-25

申请号：US18290427

申请日：2021-05-13

Applicant: LG ELECTRONICS INC.

Inventor： Sungdan LEE ,  Keunyoung LEE ,  Duho LEE

IPC: H04R31/00 ,  H04R7/12

CPC classification number: H04R31/003 ,  H04R7/127 ,  H04R2231/001 ,  H04R2307/021 ,  H04R2307/023 ,  H04R2307/025

Abstract: Embodiments relate to a diaphragm having high rigidity and high internal loss. The diaphragm may comprise: a matrix-shaped structure including a plurality of through-holes; and a graphene layer disposed in at least a part of the plurality of through-holes and coupled to the structure.