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公开(公告)号:US20240244378A1
公开(公告)日:2024-07-18
申请号:US18313349
申请日:2023-05-07
Applicant: AAC Microtech (Changzhou) Co., Ltd.
Inventor: Bo Xiao , Ronglin Linghu
CPC classification number: H04R9/06 , H04R3/00 , H04R7/06 , H04R7/18 , H04R9/025 , H04R2307/023 , H04R2400/11
Abstract: Disclosed is a speaker which improves acoustic performances and includes a frame, a vibration system, a magnetic circuit system, a front cover, a sealing diaphragm, and a sound outlet. The vibration system includes an upper diaphragm, a lower diaphragm in an annular shape, a skeleton including an annular enclosure wall, and a voice coil. The magnetic circuit system includes a bottom plate, a first magnetic unit, and a second magnetic unit. The upper diaphragm includes an inner suspension fixed to the first magnetic unit, an outer suspension fixed to the frame, and a dome. The upper diaphragm and the front cover form a first front cavity. The annular enclosure wall, the sealing diaphragm, the lower diaphragm and the frame form a second front cavity. Both the first front cavity and the second front cavity communicate with the sound outlet.
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公开(公告)号:US11968510B2
公开(公告)日:2024-04-23
申请号:US18316762
申请日:2023-05-12
Applicant: WING ACOUSTICS LIMITED
Inventor: David John Palmer , Michael Ian Palmer
CPC classification number: H04R7/24 , H04R9/025 , H04R9/06 , H04R31/003 , H04R1/1008 , H04R1/1075 , H04R15/00 , H04R17/00 , H04R19/013 , H04R2307/023 , H04R2307/027
Abstract: The invention relates to audio transducers, such as loudspeaker, microphones and the like, and includes improvements in or relating to: audio transducer diaphragm structures and assemblies, audio transducer mounting systems; audio transducer diaphragm suspension systems, personal audio devices incorporating the same and any combination thereof. The embodiments of the invention include linear action and rotational action transducers. For both types of transducer, rigid and composite diaphragm constructions and unsupported diaphragm periphery designs are described. Systems and methods for mounting the transducer to a housing, such as an enclosure or baffle are also described. Furthermore, hinge systems including: rigid contact hinge systems and flexible hinge systems are also disclosed for various rotational action transducer embodiments. Various applications and implementations are described and envisaged for the audio transducer embodiments including, for example, personal audio devices such as headphones, earphones and the like.
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公开(公告)号:US20190058955A1
公开(公告)日:2019-02-21
申请号:US15771229
申请日:2016-10-07
Applicant: Nokia Technologies Oy
Inventor: Martti VOUTILAINEN , Oleksandr KONONENKO
CPC classification number: H04R17/00 , H04R7/02 , H04R7/06 , H04R2307/023 , H04R2400/01
Abstract: An apparatus comprising a piezoelectric diaphragm positioned between opposing first and second electrodes, the piezoelectric diaphragm comprising a stack of graphene oxide layers between respective electrode-engaging layers of reduced graphene oxide, wherein the apparatus is configured to have one or more of a sound output mode and a sound input mode such that: in the sound output mode, the first and second electrodes are configured to apply a voltage to the reduced graphene oxide layers to generate an electric field across the graphene oxide stack, the generated electric field causing vibration of the piezoelectric diaphragm to produce a sound output wave corresponding to the applied voltage, and in the sound input mode, the reduced graphene oxide layers are configured to collect electrical charge which is induced in the graphene oxide layers by vibration of the piezoelectric diaphragm in response to a sound input wave, the collected electrical charge creating a voltage between the first and second electrodes corresponding to the sound input wave.
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公开(公告)号:US20180302721A1
公开(公告)日:2018-10-18
申请号:US15646884
申请日:2017-07-11
Applicant: AAC Technologies Pte. Ltd.
CPC classification number: H04R7/127 , B32B5/02 , B32B37/14 , B32B2305/076 , B32B2307/10 , B32B2309/105 , C08J5/24 , H04R31/003 , H04R2307/023
Abstract: The present disclosure provides a carbon fiber dome. The carbon fiber dome includes at least two carbon fiber prepreg layers. The at least two carbon fiber prepreg layers include carbon fiber prepregs made by at least two weaving methods. In addition, the present disclosure provides a method for manufacturing the carbon fiber dome as described above. The method includes the following steps: using prepreg resin to pre-impregnate carbon fiber materials made by at least two weaving methods; and pre-impregnating the carbon fiber materials made by at least two weaving methods for bonding each other.
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公开(公告)号:US10081533B2
公开(公告)日:2018-09-25
申请号:US14448767
申请日:2014-07-31
Applicant: Infineon Technologies AG
Inventor: Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Günter Denifl
IPC: B81B3/00 , B06B1/02 , B81C1/00 , H04R19/02 , H04R19/04 , H04R31/00 , H04R7/24 , H04R7/02 , H04R19/00
CPC classification number: B81B3/0021 , B06B1/02 , B81B3/007 , B81B2201/0257 , B81B2201/0264 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/051 , B81C1/00142 , B81C1/0015 , B81C1/00158 , B81C1/00373 , B81C2201/0176 , B81C2201/0181 , B81C2201/019 , H04R7/02 , H04R7/24 , H04R19/005 , H04R19/02 , H04R19/04 , H04R31/00 , H04R31/003 , H04R2201/003 , H04R2307/023 , H04R2400/01 , H04R2499/11
Abstract: A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.
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公开(公告)号:US20180254147A1
公开(公告)日:2018-09-06
申请号:US15971474
申请日:2018-05-04
Applicant: KEMET Electronics Corporation
Inventor: Randal J. Vaughan , Gregory L. Crosby , Abhijit Gurav
IPC: H01G4/30 , H05K1/11 , H04R19/04 , H05K1/09 , H05K1/18 , H01G4/12 , H01G4/228 , H01G4/012 , H05K3/34
CPC classification number: H01G4/30 , H01G4/012 , H01G4/1227 , H01G4/228 , H01G4/232 , H04R19/04 , H04R2307/023 , H04R2410/03 , H05K1/09 , H05K1/111 , H05K1/181 , H05K3/341 , H05K3/3431 , H05K2201/10015
Abstract: An multilayered ceramic capacitor is provided with mitigated microphonic noise propagation. The multilayered ceramic capacitor comprising a body comprising at least one face wherein the face has a body length. Parallel internal electrodes of alternating polarity are in the body wherein each internal electrode has a tab integral thereto wherein adjacent tabs are not in registration and alternate tabs are in registration. A dielectric is between adjacent internal electrodes. External terminations wherein a first external termination are in electrical contact with first tabs in registration and a second external termination is in electrical contact with second tabs in registration wherein the first external termination and second external termination are on the face and separated by a termination separation. A ratio of the termination separation to the body length is no more than 0.6 and the body comprises an extended portion beyond the external terminations.
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公开(公告)号:US20180160248A1
公开(公告)日:2018-06-07
申请号:US15868146
申请日:2018-01-11
Applicant: FUJIFILM Corporation
Inventor: Naoki MURAKAMI , Tetsu MIYOSHI
CPC classification number: H04R31/003 , G10H3/14 , G10H3/143 , G10H2220/535 , G10H2220/541 , G10H2220/551 , G10H2220/555 , H01L41/183 , H01L41/257 , H04R1/46 , H04R7/10 , H04R17/005 , H04R17/02 , H04R2307/023 , H04R2307/025 , H04R2499/15
Abstract: Provided are an electroacoustic transduction film capable of reproducing a sound with a sufficient sound volume at a high conversion efficiency, a manufacturing method thereof, an electroacoustic transducer, a flexible display, a vocal cord microphone, and a sensor for a musical instrument. The electroacoustic transduction film includes: a polymer composite piezoelectric body in which piezoelectric body particles are dispersed in a viscoelastic matrix formed of a polymer material having viscoelasticity at a normal temperature; two thin film electrodes laminated on both surfaces of the polymer composite piezoelectric body; and two protective layers respectively laminated on the two thin film electrodes, in which an intensity ratio α1=(002) plane peak intensity/((002) plane peak intensity+(200) plane peak intensity) between a (002) plane peak intensity and a (200) plane peak intensity derived from the piezoelectric body particles in a case where the polymer composite piezoelectric body is evaluated by an X-ray diffraction method is more than or equal to 0.6 and less than 1.
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公开(公告)号:US20180130458A1
公开(公告)日:2018-05-10
申请号:US15673554
申请日:2017-08-10
Applicant: BDNC (HOLDING) LIMITED
Inventor: WALTER KA WAI CHU
CPC classification number: G10K13/00 , C03C21/001 , H04R7/08 , H04R7/10 , H04R7/18 , H04R9/06 , H04R31/003 , H04R2307/023
Abstract: A compressed skins-tensioned core structure includes a first surface region; a second surface region; a core between the first surface region and the second surface region; a first transition region continuous with the first surface region at a side, and continuous with the core at another side; and a second transition region continuous with the core at a side, and continuous with the second surface region at another side, wherein each of the first surface region, the second surface region, the core, the first transition region and the second transition region is formed of a substantially homogeneous amorphous material; each of the first surface region and the second surface region exhibits an internal compressive stress, the core exhibits an internal tensile stress, and each of the first transition region and the second transition region exhibits a stress gradient from the internal compressive stress to the internal tensile stress.
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公开(公告)号:US20180109893A1
公开(公告)日:2018-04-19
申请号:US15726582
申请日:2017-10-06
Applicant: BDNC (HOLDING) LIMITED
Inventor: Walter Ka Wai Chu
CPC classification number: H04R31/006 , H04R7/10 , H04R7/12 , H04R7/16 , H04R7/20 , H04R9/022 , H04R9/025 , H04R9/045 , H04R9/06 , H04R31/003 , H04R2307/023 , H04R2307/025
Abstract: A vibration assembly for use in a speaker includes a supporting member, a light-transmissive rigid and hard diaphragm vibrating and propagating vibration for sound radiation in response to an actuating force, a flexible membrane having a first portion coupled to the rigid and hard diaphragm and configured to vibrate with the rigid and hard diaphragm, and having a second portion coupled to the supporting member for positioning the rigid and hard diaphragm, and a voice coil coupled to the rigid and hard diaphragm with a light-curing adhesive, and flowing therein an alternating current and passing therethrough magnetic lines of force generated by a magnet to provide the actuating force. The use of light-curing adhesive accelerates the automated manufacturing process.
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公开(公告)号:US09924275B2
公开(公告)日:2018-03-20
申请号:US15017452
申请日:2016-02-05
Applicant: CLEAN ENERGY LABS, LLC
IPC: H04R19/02 , H04R7/04 , H04R1/24 , H04R31/00 , H04R3/12 , H04R29/00 , H04R9/06 , H04R3/06 , H04R1/28 , H03F3/217 , H04R1/26 , H04R1/34 , H04R1/40 , H04R7/02 , H04R3/00
CPC classification number: H04R19/02 , H03F3/217 , H03F2200/03 , H04R1/24 , H04R1/26 , H04R1/288 , H04R1/2896 , H04R1/345 , H04R1/403 , H04R3/002 , H04R3/06 , H04R3/12 , H04R7/02 , H04R7/04 , H04R9/06 , H04R29/002 , H04R31/003 , H04R2207/00 , H04R2307/023 , H04R2307/025 , H04R2499/11
Abstract: An improved loudspeaker having pump cards that include an array of electrically conductive membrane transducers (such as polyester-metal membrane pumps). The array of electrically conductive membrane transducers combine to generate the desired sound by the use of pressurized airflow. The array of electrically conductive membranes has a total membrane area that is at least five times larger than the face area of the loudspeaker. In some embodiments, the loudspeaker includes a dynamic DC bus controller that maintains the DC bus level slightly above the inverter output (audio signal).
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