公开(公告)号：US10805993B2

公开(公告)日：2020-10-13

申请号：US16026188

申请日：2018-07-03

Applicant: LG ELECTRONICS INC.

Inventor： Jung Hyeong Ha ,  Sung-Hun Sim ,  Young Min Lee ,  Yun Byung Chae

IPC: A21B3/02 ,  H05B6/76 ,  E06B5/00 ,  H05B6/64

Abstract: The present disclosure relates a door and a cooking appliance with the same. The door includes a first choke part installed at the inner surface of the door panel, and disposed at a vertical outer side of the open window; a second choke part installed at the inner surface of the door panel and disposed at the lateral outer side of the open window, wherein the second choke part is disposed between the open window and the connection mechanism; and a cover frame installed at the inner surface of the door panel, configured to accommodate the connection mechanism inside the cover frame and form side walls at the vertical outer side of the first choke part and the lateral outer side of the second choke part.

公开(公告)号：US11102853B2

公开(公告)日：2021-08-24

申请号：US16182756

申请日：2018-11-07

Applicant: LG Electronics Inc.

Inventor： Jung Hyeong Ha ,  Sung-Hun Sim ,  Hyo Jin An ,  Jongseong Ji ,  Yun Byung Chae

IPC: H05B6/68 ,  H05B6/70 ,  H05B6/72 ,  H05B6/64 ,  H05B6/66

Abstract: A microwave heating system includes: a power supply; a first semiconductor module configured to receive power from the power supply and to generate a first microwave; a second semiconductor module configured to receive power from the power supply and to generate a second microwave; a heating chamber that is configured to accommodate an object at an inside of the heating chamber and that allows transmission of the first microwave and the second microwave to the inside of the heating chamber; and a control unit. The control unit is configured to control operation of each of the first semiconductor module and the second semiconductor module, and to control at least one of a frequency, a phase, or a magnitude of each of the first microwave and the second microwave to increase a heating uniformity of the object.