公开(公告)号：US20240344648A1

公开(公告)日：2024-10-17

申请号：US18754573

申请日：2024-06-26

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN

IPC分类号： F16L59/065 ,  F25D23/02 ,  F25D23/06 ,  F25D23/08

CPC分类号： F16L59/065 ,  F25D23/065 ,  F25D23/02 ,  F25D23/061 ,  F25D23/087 ,  F25D2201/14

摘要： A vacuum adiabatic body includes a heat exchange pipeline including at least two pipelines which pass through a first plate and a second plate to allow a refrigerant to move between inner and outer spaces and a sealing plug which allows the heat exchange pipeline to pass through a first point of the first plate and a second point of the second plate without contacting a third space.

公开(公告)号：US20240159449A1

公开(公告)日：2024-05-16

申请号：US18415345

申请日：2024-01-17

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Daewoong KIM ,  Hyeunsik NAM ,  Deokhyun YOUN

IPC分类号： F25D23/00 ,  F25D23/06

CPC分类号： F25D23/006 ,  F25D23/065 ,  F16L59/065

摘要： A vacuum adiabatic body includes a heat exchange pipeline and a sealing assembly. The heat exchange pipeline includes at least two pipelines which pass through a first plate and a second plate to allow a refrigerant to move between inner and outer spaces. The sealing assembly allows the heat exchange pipeline to pass through the first plate and the second plate without contacting a vacuum space provided between the first and second plates.

公开(公告)号：US20240151461A1

公开(公告)日：2024-05-09

申请号：US18416453

申请日：2024-01-18

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN ,  Sungsub LEE

IPC分类号： F25D23/06 ,  F16L59/065 ,  F25D19/00 ,  F25D23/02 ,  F25D23/08

CPC分类号： F25D23/063 ,  F16L59/065 ,  F25D19/006 ,  F25D23/028 ,  F25D23/062 ,  F25D23/064 ,  F25D23/085 ,  F25D23/087 ,  F25D2201/14

摘要： A vacuum adiabatic body is provided. The vacuum adiabatic body may include a first plate, a second plate, a seal, a support, a heat resistance device, and an exhaust port. The support may include at least two bars to support the first plate and the second plate. Each of the at least two bars may include a material having a lower emissivity than emissivities of each of the first and second plates, and each bar may be fabricated using at least one material selected from the group consisting of polycarbonate (PC), glass fiber PC, low outgassing PC, polyphenylene sulfide (PPS), and liquid crystal polymer (LCP).

公开(公告)号：US20240084952A1

公开(公告)日：2024-03-14

申请号：US18508279

申请日：2023-11-14

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN ,  Daewoong KIM

IPC分类号： F16L59/065 ,  F25D19/00 ,  F25D23/02 ,  F25D23/06 ,  F25D23/08

CPC分类号： F16L59/065 ,  F25D19/006 ,  F25D23/028 ,  F25D23/062 ,  F25D23/063 ,  F25D23/087 ,  F25D23/085 ,  F25D2201/14 ,  Y02B40/00

摘要： A vacuum adiabatic body includes: a first plate member; a second plate member; a sealing part sealing the first plate member and the second plate member to provide a third space in a vacuum state; a supporting unit; a heat resistance unit for decreasing a heat transfer amount between the first plate member and the second plate member; and an exhaust port through which a gas in the third space is exhausted. The heat resistance unit includes a conductive resistance sheet capable of resisting heat conduction flowing along a wall for the third space, and a side frame fastened to the conductive resistance sheet to define at least one portion of the wall for the third space. Accordingly, a vacuum adiabatic body may be capable of resisting heat conduction.

公开(公告)号：US20240019073A1

公开(公告)日：2024-01-18

申请号：US18034914

申请日：2021-11-01

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN ,  Bongjin KIM

IPC分类号： F16L59/065 ,  F25D23/02 ,  F25D23/06

CPC分类号： F16L59/065 ,  F25D23/028 ,  F25D23/063 ,  F25D2201/14

摘要： A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Optionally, to reduce dew formation, a side plate may have an extension portion extending outwardly of the vacuum space. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US20240011701A1

公开(公告)日：2024-01-11

申请号：US18034955

申请日：2021-11-01

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN ,  Duchan KI ,  Jaehwan LEE

IPC分类号： F25D23/06

CPC分类号： F25D23/065 ,  F25D2201/14

摘要： A vacuum adiabatic body of the present embodiment may include a first plate, a second plate, a seal configured to seal the first plate and the second plate to provide a vacuum space, and a support configured to maintain the vacuum space. Optionally, the support may include a first support having a first support plate formed in a grid shape, and a plurality of spacer coupling portions protruding from the first support plate. Optionally the support may include a second support having a second support plate formed in a grid shape, and a plurality of spacers protruding from the second support plate and coupled to each of the plurality of spacer coupling portions to form a plurality of bars together with the plurality of spacer coupling portions. Optionally, the support may include a radiation resistance sheet supported by a portion of the plurality of bars and spaced apart from at least one of the first support plate and the second support plate. Alternatively, each of the support plates may include a plurality of through-holes. Optionally, a distribution structure generated after injection molding of the first and second supports may be provided in some of the plurality of through-holes.

公开(公告)号：US20230417358A1

公开(公告)日：2023-12-28

申请号：US18034996

申请日：2021-11-01

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN ,  Jaehyun BAE

IPC分类号： F16L59/065 ,  F25D23/06

CPC分类号： F16L59/065 ,  F25D23/062 ,  F25D2201/14

摘要： A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Accordingly, the vacuum adiabatic body capable of achieving the industrial purpose may be provided.

公开(公告)号：US20230408178A1

公开(公告)日：2023-12-21

申请号：US18034807

申请日：2021-11-01

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN ,  Bongjin KIM ,  Jangseok LEE

IPC分类号： F25D23/06

CPC分类号： F25D23/065 ,  F25D2201/14

摘要： A vacuum adiabatic body includes a first plate, a second plate, and a seal for sealing the first plate and the second plate to provide a vacuum space. Optionally, the vacuum adiabatic body includes a side plate extending in a height direction of the vacuum space. Optionally, the vacuum adiabatic body includes a supporter for maintaining the vacuum space. Optionally, the vacuum adiabatic body includes a heat transfer resistor for reducing heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body includes a component coupler connected to at least one of the first and second plates and to which a component is coupled. Optionally, the second plate and the side plate are provided as one body by a single body. Thus, the productivity of the vacuum adiabatic body is improved.

公开(公告)号：US20230400246A1

公开(公告)日：2023-12-14

申请号：US18034768

申请日：2021-11-01

申请人： LG ELECTRONICS INC.

发明人： Wonyeong JUNG ,  Deokhyun YOUN ,  Duchan KI

IPC分类号： F25D23/06 ,  B23K1/00

CPC分类号： F25D23/062 ,  B23K1/0008 ,  F25D2201/14 ,  F25D23/067 ,  B23K1/002

摘要： A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Optionally, a tube passing through at least one of the first plate or the second plate may be provided. Optionally, the tube may be provided as a tube having a predetermined shape. Optionally, a filter metal provided on a bonding surface between the tube and the plate may be provided. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US20230304707A1

公开(公告)日：2023-09-28

申请号：US18325544

申请日：2023-05-30

申请人： LG Electronics Inc.

发明人： Wonyeong JUNG ,  Deokhyun YOUN

IPC分类号： F25B40/00 ,  F25D23/06

CPC分类号： F25B40/00 ,  F25D23/061 ,  F25D23/067 ,  F25D2201/14

摘要： A refrigerator includes an inner case, an outer case, a vacuum space, and a liquid-gas interchanger. The inner case defines an exterior appearance of a storage space. The outer case is spaced apart a predetermined distance from the inner case. The vacuum space is provided between the inner case and the outer case, and maintains a vacuum to insulate the inner case from the outer case. The liquid-gas interchanger is arranged in the vacuum space to generate heat exchange between a refrigerant after it is exhausted from an evaporator and a refrigerant before it is drawn into an evaporator.