公开(公告)号：US12049035B2

公开(公告)日：2024-07-30

申请号：US17402088

申请日：2021-08-13

Applicant: LG Electronics Inc.

Inventor： Jaesin Park ,  Insoo Gwag ,  Wonseok Choi

IPC: B29C45/44 ,  B29C45/26 ,  B29C45/17

CPC classification number: B29C45/44 ,  B29C45/2602 ,  B29C45/2612 ,  B29C2045/1797 ,  B29C2045/4485

Abstract: A mold apparatus for molding a rotating member includes: a column mold portion including a first column molding hole extending in a first direction and configured to mold a column portion therein and a first blade molding groove formed as an intaglio on an inner circumferential surface of the first column molding hole to have a shape corresponding to a blade and configured to mold the blade therein, and an extraction guide configured to push a first end of the column portion in the first direction to thereby extract the column portion from the first column molding hole, at least a portion of the extraction guide being positioned inside the first column molding hole. The extraction guide is configured to press the column portion to thereby extract the column portion from the first column molding hole while the column portion rotates in an inclined direction of the blade.