公开(公告)号：US12302506B2

公开(公告)日：2025-05-13

申请号：US18412020

申请日：2024-01-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Do Yun Kim ,  Seong Min Lee ,  Eun Mi Kim ,  Sang Ok Park

IPC: H05K3/32 ,  G02B7/02 ,  G03B17/12 ,  H04N23/54 ,  H04N23/60 ,  H05K1/11

Abstract: A lend moving apparatus includes a circuit board including a mounting groove, an image sensor arranged within the mounting groove of the circuit board, and a first epoxy arranged within the mounting groove. The mounting groove includes a first side surface and a second side surface that face each other, and a third side surface and a fourth side surface that face each other. The circuit board includes at least one application groove provided on the first side surface and/or the second side surface of the mounting groove. The at least one application groove includes an opening opened toward the upper surface of the circuit board. At least a portion of the first epoxy is arranged in the at least one application groove.

公开(公告)号：US11822212B2

公开(公告)日：2023-11-21

申请号：US17646123

申请日：2021-12-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Yeon Han ,  Do Yun Kim ,  Jung Hwan Kim ,  Yong Nam Choi

IPC: G03B13/36 ,  G02B7/09 ,  G02B27/64 ,  G03B43/00 ,  G03B3/10 ,  H02K33/02 ,  G03B17/02 ,  H04N23/00 ,  H04N23/55

CPC classification number: G03B13/36 ,  G02B7/09 ,  G02B27/64 ,  G03B3/10 ,  G03B17/02 ,  G03B43/00 ,  H02K33/02 ,  H04N23/00 ,  H04N23/55

Abstract: One embodiment of a camera module comprises: a lens barrel including at least one lens; a bobbin for accommodating the lens barrel; and a fixing part disposed between the lens barrel and the bobbin so as to inhibit the lens barrel from being separated from the bobbin, wherein one surface, which makes surface contact with the fixing part, of the bobbin can include a bobbin provided so as to protrude toward the lens barrel.

公开(公告)号：US20220197114A1

公开(公告)日：2022-06-23

申请号：US17646123

申请日：2021-12-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Yeon Han ,  Do Yun Kim ,  Jung Hwan Kim ,  Yong Nam Choi

IPC: G03B13/36 ,  G02B7/09 ,  G02B27/64 ,  H04N5/225 ,  G03B43/00 ,  G03B3/10 ,  H02K33/02 ,  G03B17/02

Abstract: One embodiment of a camera module comprises: a lens barrel including at least one lens; a bobbin for accommodating the lens barrel; and a fixing part disposed between the lens barrel and the bobbin so as to inhibit the lens barrel from being separated from the bobbin, wherein one surface, which makes surface contact with the fixing part, of the bobbin can include a bobbin provided so as to protrude toward the lens barrel.

公开(公告)号：US11903142B2

公开(公告)日：2024-02-13

申请号：US17058185

申请日：2019-05-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Do Yun Kim ,  Seong Min Lee ,  Eun Mi Kim ,  Sang Ok Park

IPC: H05K3/32 ,  G02B7/02 ,  G03B17/12 ,  H05K1/11 ,  H04N23/54 ,  H04N23/60

CPC classification number: H05K3/321 ,  G02B7/02 ,  G03B17/12 ,  H04N23/54 ,  H04N23/60 ,  H05K1/11

Abstract: One embodiment comprises a circuit board including a mounting groove, an image sensor arranged within the mounting groove of the circuit board, and a first epoxy arranged within the mounting groove, wherein the mounting groove comprises a first side surface and a second side surface that face each other, and a third side surface and a fourth side surface that face each other, the circuit board includes at least one application groove provided on the first side surface and/or the second side surface of the mounting groove, the at least one application groove includes an opening opened toward the upper surface of the circuit board, and at least a portion of the first epoxy is arranged in the at least one application groove.