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公开(公告)号:US20210168945A1
公开(公告)日:2021-06-03
申请号:US17058185
申请日:2019-05-29
Applicant: LG INNOTEK CO., LTD.
Inventor: Do Yun KIM , Seong Min LEE , Eun Mi KIM , Sang Ok PARK
Abstract: One embodiment comprises a circuit board including a mounting groove, an image sensor arranged within the mounting groove of the circuit board, and a first epoxy arranged within the mounting groove, wherein the mounting groove comprises a first side surface and a second side surface that face each other, and a third side surface and a fourth side surface that face each other, the circuit board includes at least one application groove provided on the first side surface and/or the second side surface of the mounting groove, the at least one application groove includes an opening opened toward the upper surface of the circuit board, and at least a portion of the first epoxy is arranged in the at least one application groove.
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公开(公告)号:US20250071256A1
公开(公告)日:2025-02-27
申请号:US18726088
申请日:2022-12-29
Applicant: LX SEMICON CO., LTD. , LG INNOTEK CO., LTD.
Inventor: Kyu Ho KIM , Seung Jun CHOI , Jin Kook YUN , Young Seop MOON , Eun Mi KIM
IPC: H04N17/00 , G01D5/14 , H04N23/667 , H04N23/68
Abstract: The present invention relates to a controller of a camera module capable of simplifying a measurement system and reducing cost by having a frequency response measurement function.
A controller of camera module according to an embodiment, in a driving mode, preprocesses an actuator position value signal sensed by a Hall sensor to output to a measurement equipment, a target position value, arithmetic processes a target position value, an actuator position value signal and a disturbance signal supplied from the measurement equipment to output an error value signal to the measurement equipment, and generates an actuator driving signal that compensates for the error value signal to drive an actuator.-
公开(公告)号:US20240155775A1
公开(公告)日:2024-05-09
申请号:US18412020
申请日:2024-01-12
Applicant: LG INNOTEK CO., LTD.
Inventor: Do Yun KIM , Seong Min LEE , Eun Mi KIM , Sang Ok PARK
Abstract: A lend moving apparatus includes a circuit board including a mounting groove, an image sensor arranged within the mounting groove of the circuit board, and a first epoxy arranged within the mounting groove. The mounting groove includes a first side surface and a second side surface that face each other, and a third side surface and a fourth side surface that face each other. The circuit board includes at least one application groove provided on the first side surface and/or the second side surface of the mounting groove. The at least one application groove includes an opening opened toward the upper surface of the circuit board. At least a portion of the first epoxy is arranged in the at least one application groove.
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