公开(公告)号：US20240413073A1

公开(公告)日：2024-12-12

申请号：US18699554

申请日：2022-09-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Han Sang KIM ,  Bo Ra KANG ,  Jeong Han KIM

IPC: H01L23/498 ,  H01L23/00

Abstract: A circuit board according to an embodiment includes an insulating layer; and a circuit pattern layer disposed on the insulating layer, wherein the insulating layer includes a surface layer containing fluorine (F), and the circuit pattern layer is disposed on the surface layer of the insulating layer.

公开(公告)号：US20240407095A1

公开(公告)日：2024-12-05

申请号：US18699544

申请日：2022-09-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Han Sang KIM ,  Bo Ra KANG ,  Yong Suk KIM

IPC: H05K1/11 ,  H01L23/498 ,  H05K1/02

Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.