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    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    1.
    发明申请
    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME 有权

    公开(公告)号：US20240414844A1

    公开(公告)日：2024-12-12

    申请号：US18699444

    申请日：2022-09-30

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Bo Ra KANG ,  Jeong Han KIM

    IPC: H05K1/11 ,  H01L23/498 ,  H05K1/02

    Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, the coating layer includes a first functional group, and the first insulating layer includes a reactive group bonded to the first functional group.

    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE SAME
    2.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE SAME 审中-公开
    发光装置包装和照明装置，包括它们

    公开(公告)号：US20150221839A1

    公开(公告)日：2015-08-06

    申请号：US14614121

    申请日：2015-02-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Gwui Youn PARK ,  Bo Ra KANG ,  Sung Phil KIM

    IPC: H01L33/58 ,  H01L25/075

    CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/20 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Disclosed are a light emitting device package and a light apparatus including the same. The light emitting device package according to an embodiment of the present disclosure includes a light emitting device that has a first side extending in a first direction and a second side extending in a second direction, and is disposed on a substrate, and a molding unit that has a shape of an isotropic lens disposed on the substrate to surround the light emitting device, wherein a square root of {(length of the first side)2+(length of the second side)2} is smaller than a diameter of the isotropic lens, and the length of the first side is at least 5/3 times more than the length of the second side. According to the present disclosure, the light emitting device may be formed into a rectangular shape or a plurality of light emitting devices may be arranged in a rectangular shape, and therefore an anisotropic illumination distribution may be obtained while applying an isotropic lens which can be easily designed and manufactured, thereby reducing manufacturing time and costs while increasing optical efficiency.

    Abstract translation: 公开了一种发光器件封装和包括该发光器件封装的光装置。 根据本公开的实施例的发光器件封装包括发光器件，其具有沿第一方向延伸的第一侧和沿第二方向延伸的第二侧，并且设置在基板上，以及模制单元， 具有设置在基板上以围绕发光器件的各向同性透镜的形状，其中{（第一侧的长度）2+（第二面的长度）2}的平方根小于各向同性的直径 透镜，并且第一面的长度为第二面的长度的至少5/3倍以上。 根据本公开，发光器件可以形成为矩形形状，或者多个发光器件可以布置成矩形形状，因此可以在施加易于使用的各向同性透镜的同时获得各向异性照明分布 设计和制造，从而减少制造时间和成本，同时提高光学效率。

    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE SAME
    6.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE SAME 有权
    发光装置包装和照明装置，包括它们

    公开(公告)号：US20150221620A1

    公开(公告)日：2015-08-06

    申请号：US14614004

    申请日：2015-02-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Gwui Youn PARK ,  Bo Ra KANG ,  Sung Phil KIM ,  Yang Hyun JOO

    IPC: H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting device package includes: a light emitting device disposed on a substrate; a diffusion plate disposed on the substrate to surround the light emitting device; and a molding portion that is disposed on the substrate and has a shape of an aspheric lens whose center is recessed, The center of the molding portion is located on the same axis as the center of the light emitting device, and the diffusion plate may be interposed between the light emitting device and the molding portion. The molding portion having the shape of the aspheric lens whose center is recessed and the diffusion plate are employed to widely diffuse the light emitted from the light emitting device. Thereby, the efficiency of light can be increased, and manufacturing time and cost can be reduced. Simultaneously, a yellow ring phenomenon can be avoided.

    Abstract translation: 发光器件封装包括：设置在基板上的发光器件; 扩散板，其设置在所述基板上以围绕所述发光器件; 以及模制部，其设置在所述基板上并且具有中心凹陷的非球面透镜的形状。所述模制部的中心位于与所述发光装置的中心相同的轴上，并且所述扩散板可以 插入在发光器件和模制部分之间。 具有中心凹陷的非球面透镜的形状的模制部分和扩散板用于使从发光器件发射的光广泛地扩散。 由此，能够提高光的效率，能够降低制造时间和成本。 同时，可以避免黄色环现象。

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    8.
    发明申请
    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME 有权

    公开(公告)号：US20240407095A1

    公开(公告)日：2024-12-05

    申请号：US18699544

    申请日：2022-09-30

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Han Sang KIM ,  Bo Ra KANG ,  Yong Suk KIM

    IPC: H05K1/11 ,  H01L23/498 ,  H05K1/02

    Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.

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