公开(公告)号：US20130284502A1

公开(公告)日：2013-10-31

申请号：US13872682

申请日：2013-04-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae Man PARK ,  Hae Yeon KIM ,  SungBae MOON ,  Jeungook PARK ,  SungJin YUN ,  JongHeum YOON ,  Hyuk Soo LEE ,  Jaehun JEONG ,  In Hee CHO

IPC: C08L63/00 ,  H05K1/05 ,  C07D303/46

CPC classification number: C08L63/00 ,  C07D303/46 ,  C08G59/28 ,  H05K1/05

Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.

Abstract translation: 提供包含环氧树脂，硬化剂和无机填料作为主要成分的环氧树脂化合物。 环氧树脂包括由化学式表示的环氧树脂。 因此，使用具有提高结晶性的介晶结构的环氧树脂，因此可以提高导热性。 此外，环氧树脂用作印刷电路板的绝缘材料，因此可以提供高辐射热衬底。