公开(公告)号：US20130284502A1

公开(公告)日：2013-10-31

申请号：US13872682

申请日：2013-04-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae Man PARK ,  Hae Yeon KIM ,  SungBae MOON ,  Jeungook PARK ,  SungJin YUN ,  JongHeum YOON ,  Hyuk Soo LEE ,  Jaehun JEONG ,  In Hee CHO

IPC: C08L63/00 ,  H05K1/05 ,  C07D303/46

CPC classification number: C08L63/00 ,  C07D303/46 ,  C08G59/28 ,  H05K1/05

Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.

Abstract translation: 提供包含环氧树脂，硬化剂和无机填料作为主要成分的环氧树脂化合物。 环氧树脂包括由化学式表示的环氧树脂。 因此，使用具有提高结晶性的介晶结构的环氧树脂，因此可以提高导热性。 此外，环氧树脂用作印刷电路板的绝缘材料，因此可以提供高辐射热衬底。

公开(公告)号：US20150069457A1

公开(公告)日：2015-03-12

申请号：US14467993

申请日：2014-08-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Sungbae MOON ,  Jaehun JEONG ,  Mi Jin LEE ,  Soomin LEE ,  Yuwon LEE

IPC: C08G59/38 ,  C08K9/10 ,  H01L33/56 ,  C08G59/42

CPC classification number: H01L33/56 ,  C08G59/306 ,  C08G59/3236 ,  C08G59/38 ,  C08G59/4223 ,  C08G59/4276 ,  C08K3/04 ,  C08K3/041 ,  C08K3/20 ,  C08K9/02 ,  C08K2003/2237 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  C08L83/06 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin, 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of a polyester-based curing agent, wherein the epoxy resin comprises a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group.

Abstract translation: 根据本发明实施方案的环氧树脂组合物包含环氧树脂，基于10重量份的环氧树脂为0.05-190重量份的聚酯基固化剂，其中环氧树脂包含三嗪 衍生环氧化合物和含有脂环族环氧基和硅氧烷基的硅氧烷化合物。