公开(公告)号：US20230337540A1

公开(公告)日：2023-10-19

申请号：US18213314

申请日：2023-06-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Sung JO ,  Sue Kyung Oh

IPC: H10N10/17 ,  H10N10/852

CPC classification number: H10N10/17 ,  H10N10/852

Abstract: A thermoelectric module may comprise: a first metal support; a first heat conductive layer; a second heat conductive layer and formed from a resin composition; a plurality of first electrodes arranged on the second heat conductive layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third heat conductive layer, wherein the second heat conductive layer is arranged to encompass an upper surface of the first heat conductive layer and a side surface of the first heat conductive layer.

公开(公告)号：US20240268031A1

公开(公告)日：2024-08-08

申请号：US18565577

申请日：2022-05-31

Applicant: LG INNOTEK CO., LTD.

Inventor： In Jae LEE ,  Min Sung JO

IPC: H05K1/18 ,  H05K1/09

CPC classification number: H05K1/181 ,  H05K1/092 ,  H05K2201/10659

Abstract: A circuit board according to an embodiment includes: an insulating layer; and a circuit pattern layer disposed on the insulating layer and formed of an alloy, wherein the alloy includes: a first metal having a content in a range of 60 wt % to 80 wt %; a second metal having a content in a range of 10 wt % to 22 wt %; and a third metal having a content in a range of 3 wt % to 20 wt %; wherein the first metal includes any one of nickel (Ni) and iron (Fe), wherein the second metal includes chromium (Cr), and wherein the third metal includes a metal different from the first metal among nickel (Ni) and iron (Fe).

公开(公告)号：US20220020910A1

公开(公告)日：2022-01-20

申请号：US17295106

申请日：2019-12-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Sung JO

IPC: H01L35/32 ,  H01L35/04 ,  H01L35/34

Abstract: Disclosed is a thermoelectric module. One embodiment of the thermoelectric modules comprises: a first substrate; a first electrode disposed on the first substrate; a thermoelectric leg disposed on the first electrode; a second electrode disposed on the thermoelectric leg; a second substrate disposed on the second electrode; a plurality of wire parts electrically connected to the first electrode and the second electrode; a first sealing part disposed on the first substrate and surrounding the side surface of the second substrate; and a second sealing part passing through the first sealing part and disposed on the inside and outside of the first sealing part. At least one of the plurality of wire parts is partially disposed inside the second sealing part. The second sealing part includes: a first region which is closest to the first sealing part outside the first sealing part; and a second region which is disposed outside the first region and is in contact with the wire part partially disposed inside the second sealing part, wherein the thickness of the second region is less than the thickness of the first region.

公开(公告)号：US20210083165A1

公开(公告)日：2021-03-18

申请号：US16963663

申请日：2019-01-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Sung JO ,  Sue Kyung OH

IPC: H01L35/32 ,  H01L35/16

Abstract: A thermoelectric module according to one embodiment of the present invention comprises: a first metal support; a first heat conductive layer arranged on the first metal support and formed from a resin composition including an epoxy resin and an inorganic filler; a second heat conductive layer arranged on the first heat conductive layer and formed from a resin composition including a silicon resin and an inorganic filler a plurality of first electrodes arranged on the second heat conductive layer a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third heat conductive layer, wherein the second heat conductive layer is arranged to encompass an upper surface of the first heat conductive layer and a side surface of the first heat conductive layer.