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    Thermoelectric module
    1.
    发明授权
    Thermoelectric module 有权

    公开(公告)号：US11716904B2

    公开(公告)日：2023-08-01

    申请号：US17295106

    申请日：2019-12-13

    申请人： LG INNOTEK CO., LTD.

    发明人： Min Sung Jo

    IPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/81

    CPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/81

    摘要： Disclosed is a thermoelectric module. One embodiment of the thermoelectric modules comprises: a first substrate; a first electrode disposed on the first substrate; a thermoelectric leg disposed on the first electrode; a second electrode disposed on the thermoelectric leg; a second substrate disposed on the second electrode; a plurality of wire parts electrically connected to the first electrode and the second electrode; a first sealing part disposed on the first substrate and surrounding the side surface of the second substrate; and a second sealing part passing through the first sealing part and disposed on the inside and outside of the first sealing part. At least one of the plurality of wire parts is partially disposed inside the second sealing part. The second sealing part includes: a first region which is closest to the first sealing part outside the first sealing part; and a second region which is disposed outside the first region and is in contact with the wire part partially disposed inside the second sealing part, wherein the thickness of the second region is less than the thickness of the first region.

    Thermoelectric module
    2.
    发明授权
    Thermoelectric module 有权

    公开(公告)号：US11730056B2

    公开(公告)日：2023-08-15

    申请号：US16963663

    申请日：2019-01-22

    申请人： LG INNOTEK CO., LTD.

    发明人： Min Sung Jo ,  Sue Kyung Oh

    IPC分类号： H10N10/17 ,  H10N10/852

    CPC分类号： H10N10/17 ,  H10N10/852

    摘要： A thermoelectric module according to one embodiment of the present invention comprises: a first metal support; a first heat conductive layer arranged on the first metal support and formed from a resin composition including an epoxy resin and an inorganic filler; a second heat conductive layer arranged on the first heat conductive layer and formed from a resin composition including a silicon resin and an inorganic filler a plurality of first electrodes arranged on the second heat conductive layer a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third heat conductive layer, wherein the second heat conductive layer is arranged to encompass an upper surface of the first heat conductive layer and a side surface of the first heat conductive layer.