公开(公告)号：US12133465B2

公开(公告)日：2024-10-29

申请号：US15592726

申请日：2017-05-11

申请人： FREE FORM FIBERS, LLC

发明人： Joseph Pegna ,  Erik G. Vaaler ,  John L. Schneiter ,  Shay L. Harrison

IPC分类号： C23C16/48 ,  H10N10/01 ,  H10N10/81 ,  H10N30/00 ,  H10N30/06 ,  H10N30/87 ,  H10N10/10

CPC分类号： H10N10/81 ,  C23C16/483 ,  H10N10/01 ,  H10N30/06 ,  H10N30/702 ,  H10N30/87 ,  H10N10/10

摘要： A method is provided for making a multilayer functional fiber, where the method includes: providing a scaffold fiber; disposing a first electrode layer enclosing the scaffold fiber; disposing a functional layer enclosing the first electrode layer, the functional layer having a functional characteristic varying as a function of longitudinal position along the functional layer; disposing a second electrode layer enclosing the functional layer; and disposing a cladding layer enclosing the second electrode layer. In another aspect, a multilayer functional fiber is provided produced by, for instance, the above-noted method.

公开(公告)号：US20240345425A1

公开(公告)日：2024-10-17

申请号：US18756209

申请日：2024-06-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Yu-Hao CHEN ,  Hui Yu LEE ,  Jui-Feng KUAN ,  Chien-Te WU

IPC分类号： G02F1/01 ,  H10N10/01 ,  H10N10/17 ,  H10N10/80 ,  H10N10/852 ,  H10N10/855

CPC分类号： G02F1/0147 ,  G02F1/011 ,  H10N10/01 ,  H10N10/17 ,  H10N10/80 ,  G02F2203/50 ,  H10N10/852 ,  H10N10/855

摘要： A method includes forming, over a substrate, an optical component and first, second and third thermal control mechanisms. The optical component includes first and second main paths, and first and second side paths each having opposite ends correspondingly coupled to the first and second main paths. The second side path is spaced from the first side path. Each of the first, second and third thermal control mechanisms includes a first thermoelectric member having a first conductivity type, a second thermoelectric member having a second conductivity type opposite to the first conductivity type, and a conductive structure that electrically connects the first thermoelectric member to the second thermoelectric member. The first side path is between the first and third thermal control mechanisms. The second side path is between the second and third thermal control mechanisms. The third thermal control mechanism is between the first and second side paths.

公开(公告)号：US12108677B2

公开(公告)日：2024-10-01

申请号：US18163694

申请日：2023-02-02

申请人： Industry-University Cooperation Foundation Hanyang University Erica Campus ,  Ajou University Industry-Academic Cooperation Foundation

发明人： Tae Joo Park ,  Sang Woon Lee ,  Dae Woong Kim ,  Tae Jun Seok ,  Jae Hyun Yoon ,  Ji Hyeon Choi

IPC分类号： H10N10/855 ,  H01L23/427 ,  H10N10/01 ,  H10N10/13 ,  H10N10/817 ,  H10N10/82

CPC分类号： H10N10/855 ,  H01L23/427 ,  H10N10/01 ,  H10N10/13 ,  H10N10/817 ,  H10N10/82

摘要： Provided is a preparation method for a thermoelectric composite. The preparation method for a thermoelectric composite comprises the steps of: preparing a base substrate containing a first binary metal oxide; and providing a metal precursor and a reaction material containing oxygen (O) onto the base substrate to form a material film containing a second biliary metal oxide resulting from the reaction of the metal precursor and the reaction material, wherein in the step of forming the material film, a 2-dimensional electron gas is generated between the base substrate and the material film as the material film is formed on the base substrate.

公开(公告)号：US20240292753A1

公开(公告)日：2024-08-29

申请号：US18589066

申请日：2024-02-27

申请人： Northwestern University ,  Battelle Energy Allliance, LLC

发明人： David C. Dunand ,  Donna P. Guillen ,  Alexander Ernst Ludwig Proschel ,  Dennis S. Tucker

IPC分类号： H10N10/01 ,  B22F3/10 ,  B22F3/20 ,  B22F10/10 ,  H10N10/854

CPC分类号： H10N10/01 ,  B22F3/1021 ,  B22F3/1039 ,  B22F3/20 ,  B22F10/10 ,  H10N10/854 ,  B22F2301/15 ,  B22F2301/205 ,  B22F2301/30

摘要： In certain aspects of the disclosure, a method includes creating ink specimens. The method includes solidifying, via solvent evaporation, the ink specimens to identify Ni powders and Ti powders. The method includes debinding and pre-sintering the Ni powders and the Ti powders to form a porous NiTi skeleton. The method includes infiltrating the porous NiTi skeleton with a transient liquid. The method includes reaction sintering the NiTi of the porous NiTi skeleton and the Sn to reactively form TiNiSn. Ternary-phase thermoelectric materials formed by the method are also provided.

公开(公告)号：US12063861B2

公开(公告)日：2024-08-13

申请号：US16830955

申请日：2020-03-26

申请人： MITSUBISHI MATERIALS CORPORATION ,  TOYOTA SCHOOL FOUNDATION

发明人： Toshiaki Fujita ,  Koya Arai ,  Tsunehiro Takeuchi ,  Takuya Matsunaga

IPC分类号： H10N10/817 ,  F25B21/02 ,  F28F13/16 ,  H10N10/01 ,  H10N10/13

CPC分类号： H10N10/817 ,  F25B21/02 ,  F28F13/16 ,  H10N10/01 ,  H10N10/13

摘要： A heat flow switching element includes a substrate of which at least an upper surface is formed of an insulating material, an N-type semiconductor layer, a P-type semiconductor layer, and an insulator layer, in which one semiconductor layer of the N-type semiconductor layer and the P-type semiconductor layer is formed on the substrate, the insulator layer is formed on the one semiconductor layer, and the other semiconductor layer of the N-type semiconductor layer and the P-type semiconductor layer is formed on the insulator layer. In this way, electric charges induced by an external voltage are generated both at and near an interface between the N-type semiconductor layer and the insulator layer and at and near an interface between the P-type semiconductor layer and the insulator layer.

公开(公告)号：US20240260470A1

公开(公告)日：2024-08-01

申请号：US18565913

申请日：2022-06-05

申请人： DOUBLE CHECK LTD.

发明人： ISAAC STEINER ,  ALEX GUREVICH

IPC分类号： H10N10/13 ,  H10N10/01 ,  H10N10/17

CPC分类号： H10N10/13 ,  H10N10/01 ,  H10N10/17

摘要： A thermoelectric module (TEM) for cooling and power generation applications. The TEM includes a pair of substrates, where one or more of the substrates is a vapor chamber. The TEM further includes a plurality of electrically conductive contacts disposed on opposing faces of the pair of substrates. A plurality of thermoelectric legs interposed between the pair of substrates, each of the plurality of conductive contacts connecting thermoelectric legs to each other in series and wherein each of the thermoelectric legs has a first end connected to one of the conductive contacts of one of the substrates and a second end connected to one of the conductive contacts of the other of the substrates.

公开(公告)号：US20240244977A1

公开(公告)日：2024-07-18

申请号：US18559947

申请日：2022-04-29

申请人： European Thermodynamics Limited

发明人： Richard TULEY ,  Eleni-Chrysanthi STEFANAKI

IPC分类号： H10N10/82 ,  H10N10/01 ,  H10N10/17

CPC分类号： H10N10/82 ,  H10N10/01 ,  H10N10/17

摘要： A thermoelectric module comprising:



a first electrically-insulating substrate having a first face and a second face opposite the first face, wherein a first plurality of electrical interconnects is disposed in a first pattern on the first face;
a second electrically-insulating substrate spaced from the first electrically-insulating substrate and having a first face facing the first face of the first electrically-insulating substrate, wherein a second plurality of electrical interconnects is disposed in a second pattern on the first face of the second electrically-insulating substrate;
a plurality of thermoelectric elements comprising n-type thermoelectric elements and p-type thermoelectric elements disposed between the first electrically-insulating substrate and the second electrically-insulating substrate, wherein each thermoelectric element extends from one of the first plurality of electrical interconnects to one of the second plurality of electrical interconnects, wherein the thermoelectric elements are arranged to form a first series-connected string of alternating n-type and p-type thermoelectric elements and a second series-connected string of alternating n-type and p-type thermoelectric elements and at least one of the n-type or p-type thermoelectric elements in the first series-connected string is electrically connected in parallel with one of the thermoelectric elements of the same type (n-type or p-type) in the second series-connected string; and
one or more regions of metallic material are disposed in a third pattern on the second face of the first electrically-insulating substrate.

公开(公告)号：US12035628B2

公开(公告)日：2024-07-09

申请号：US17843604

申请日：2022-06-17

申请人： TIANMA JAPAN, LTD. ,  Akita Prefecture

发明人： Nobuya Seko ,  Kazuyuki Ise

IPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/81 ,  H10N10/854

CPC分类号： H10N10/17 ,  H10N10/01 ,  H10N10/81 ,  H10N10/854

摘要： A thermoelectric transducer includes a substrate, a thermoelectric film on the substrate, a first electrode on the substrate, and a second electrode on the substrate, the second electrode being different from the first electrode in work function. The first electrode and the second electrode are in contact with the same side of the thermoelectric film. The outer edge of the thermoelectric film is located inner than the outer edge of the substrate.

公开(公告)号：US20240188442A1

公开(公告)日：2024-06-06

申请号：US18443637

申请日：2024-02-16

申请人： LG INNOTEK CO, LTD.

发明人： Myoung Seok SUNG ,  Tae Hee KIM

IPC分类号： H10N10/82 ,  H10N10/01 ,  H10N10/17 ,  H10N10/852

CPC分类号： H10N10/82 ,  H10N10/01 ,  H10N10/17 ,  H10N10/852

摘要： A thermoelectric element according to an embodiment comprises: a first substrate; a first electrode part disposed on the first substrate; a thermoelectric semiconductor disposed on the first electrode part; second electrode parts disposed on the thermoelectric semiconductor; and a second substrate disposed on the second electrode parts, wherein the second substrate comprises: a first surface; and a second surface opposite to the first surface, the second electrode parts are disposed on the first surface, a terminal electrode part formed by extending at least one of the second electrode parts is disposed on the second surface, and the second substrate is formed between the terminal electrode part and the second electrode parts.

公开(公告)号：US12004424B2

公开(公告)日：2024-06-04

申请号：US17779623

申请日：2019-12-06

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Ravi Palaniswamy ,  Antonny Flor ,  Sheldon B. Ruiz ,  Milind B. Sabade

IPC分类号： H10N10/01 ,  H10N10/13 ,  H10N10/17 ,  H10N10/852 ,  H10N10/855

CPC分类号： H10N10/01 ,  H10N10/13 ,  H10N10/17 ,  H10N10/852 ,  H10N10/855

摘要： The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.