公开(公告)号：US12041716B2

公开(公告)日：2024-07-16

申请号：US17757880

申请日：2020-12-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Nam Heon Kim

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/028 ,  H05K1/0313 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/09009

Abstract: A substrate according to an embodiment includes an insulating layer having a grain formed therein extending in a first direction; and a circuit pattern disposed on the insulating layer; wherein the insulating layer includes an upper surface and a plurality of outer side surfaces; wherein the plurality of outer side surfaces includes: a first outer side surface extending in the same first direction as the first direction having the grain formed in the insulating layer; and a second outer side surface extending in a second direction different from the first direction and excluding the first outer side surface, wherein the first outer side surface has a first surface roughness; and wherein the second outer side surface has a second surface roughness different from the first surface roughness.