公开(公告)号：US12014868B2

公开(公告)日：2024-06-18

申请号：US17165933

申请日：2021-02-02

申请人： CYNTEC CO., LTD.

发明人： Yi-Cheng Lin

IPC分类号： H05K1/09 ,  H01F27/255 ,  H01F41/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H01F1/22

CPC分类号： H01F41/0233 ,  H01F27/255 ,  H01F41/0246 ,  H05K1/09 ,  H05K1/111 ,  H05K1/18 ,  H05K3/341 ,  H05K3/40 ,  H01F1/22 ,  H05K2201/09009 ,  H05K2201/10007

摘要： An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.

公开(公告)号：US20190215956A1

公开(公告)日：2019-07-11

申请号：US16358315

申请日：2019-03-19

申请人： International Business Machines Corporation

发明人： Eric J. CAMPBELL ,  Joseph KUCZYNSKI ,  Timothy J. TOFIL

IPC分类号： H05K1/03 ,  H05K1/02 ,  B29C35/02

CPC分类号： H05K1/0353 ,  B29C35/02 ,  B29C35/0272 ,  B29K2105/0872 ,  B29K2105/162 ,  B29K2995/0008 ,  B29L2031/3425 ,  H05K1/0201 ,  H05K2201/068 ,  H05K2201/09009

摘要： A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.

公开(公告)号：US20180356048A1

公开(公告)日：2018-12-13

申请号：US15697149

申请日：2017-09-06

申请人： Fluence Bioengineering

发明人： Dung Duong ,  Randy Johnson ,  Nick Klase

IPC分类号： F21K9/232 ,  F21V29/83 ,  F21V29/70 ,  H05K1/02

CPC分类号： F21V23/005 ,  A01G7/045 ,  F21K9/232 ,  F21K9/90 ,  F21S4/28 ,  F21V7/005 ,  F21V7/0066 ,  F21V7/05 ,  F21V15/015 ,  F21V17/107 ,  F21V19/0015 ,  F21V19/003 ,  F21V23/001 ,  F21V23/02 ,  F21V23/0442 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H05B33/0854 ,  H05B37/0227 ,  H05B37/0272 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0274 ,  H05K1/0277 ,  H05K1/05 ,  H05K1/056 ,  H05K1/181 ,  H05K1/182 ,  H05K1/185 ,  H05K3/0014 ,  H05K3/28 ,  H05K3/32 ,  H05K3/44 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/10106

摘要： Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.

公开(公告)号：US20180292276A1

公开(公告)日：2018-10-11

申请号：US15867817

申请日：2018-01-11

申请人： DIRECTION TECHNOLOGY CO., LTD.

发明人： Yu-Yu Chen

IPC分类号： G01L5/00 ,  G01L3/10 ,  H02N99/00 ,  H05K1/18 ,  A63B22/06 ,  A63B21/22 ,  A63B22/00 ,  A63B24/00

CPC分类号： G01L5/00 ,  A63B21/225 ,  A63B22/0076 ,  A63B22/0605 ,  A63B24/0062 ,  A63B2209/00 ,  A63B2220/54 ,  A63B2225/50 ,  G01L3/108 ,  H02N99/00 ,  H05K1/181 ,  H05K2201/09009

摘要： A flywheel torsion measuring device with internal power, applied to a shaft and a flywheel of sports equipment, has a wheel connector, a power unit, a torsion measuring element and circuit boards. The wheel connector, for fastening the flywheel and connecting the shaft through a bearing, has an assembly space and an annular plate. The power unit provides a power. The torsion measuring elements are disposed on the annular plate of the wheel connector, and the circuit board, which is disposed in the assembly space of the wheel connector and electrically connects the power unit and the torsion measuring elements, converts the power into a working power for the torsion measuring element. The wireless transmission module of the circuit board transmits the measurement information generated by the torsion measurement component to the outside.

公开(公告)号：US10076040B2

公开(公告)日：2018-09-11

申请号：US15460271

申请日：2017-03-16

申请人： LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORPORATION

发明人： Yi-Feng Pu ,  Po-Yu Cheng ,  Tzu-Shu Lin

IPC分类号： H05K3/28 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K3/284 ,  H05K1/0216 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/303 ,  H05K3/4688 ,  H05K2201/0129 ,  H05K2201/09009 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2203/0285 ,  H05K2203/085 ,  H05K2203/1311 ,  H05K2203/1322

摘要： A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.

公开(公告)号：US09930773B2

公开(公告)日：2018-03-27

申请号：US15188453

申请日：2016-06-21

申请人： Microsoft Technology Licensing, LLC

发明人： James David Holbery ,  Siyuan Ma ,  Michael David Dickey

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/46 ,  G06F1/16

CPC分类号： H05K1/0272 ,  G06F1/1613 ,  H01R12/59 ,  H01R12/77 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/03 ,  H05K1/092 ,  H05K1/148 ,  H05K3/10 ,  H05K3/1275 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/055 ,  H05K2201/09009 ,  H05K2201/09736 ,  H05K2203/0776

摘要： Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

公开(公告)号：US09674597B1

公开(公告)日：2017-06-06

申请号：US15040465

申请日：2016-02-10

申请人： Bose Corporation

发明人： Michael O'Connell

IPC分类号： H04R1/02 ,  H04R1/10 ,  H05K1/02

CPC分类号： H04R1/1016 ,  H04R1/1008 ,  H04R1/1091 ,  H04R5/033 ,  H05K1/0272 ,  H05K1/028 ,  H05K1/0298 ,  H05K2201/09009 ,  H05K2201/09072 ,  H05K2201/10083

摘要： An electrical circuit board assembly that can be used in a headphone includes acoustic elements incorporated into a rigid or flexible circuit board. The electrical circuit board assembly permits the convenient routing of electrical circuitry and acoustic elements, such as an acoustic port, between acoustic chambers in the headphone. The acoustic port includes a channel embedded in in the circuit board. Control of the dimensions of the channel is achieved using conventional circuit board assembly techniques. Advantageously, the circuit board assembly enables convenient and repeatable assembly into headphones, such as earbuds, and results in more consistent acoustic performance from the headphones.

公开(公告)号：US09538653B2

公开(公告)日：2017-01-03

申请号：US14855798

申请日：2015-09-16

申请人： NGK INSULATORS, LTD.

发明人： Tatsuro Takagaki ,  Yasunori Iwasaki ,  Sugio Miyazawa ,  Akiyoshi Ide ,  Hirokazu Nakanishi

IPC分类号： H01B17/00 ,  H05K1/11 ,  C04B35/119 ,  H01B3/12 ,  C04B35/111 ,  H05K1/03 ,  H05K3/00 ,  H01B17/56 ,  C04B35/634

CPC分类号： H05K1/115 ,  C04B35/111 ,  C04B35/119 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3418 ,  C04B2235/6023 ,  C04B2235/606 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  H01B3/12 ,  H01B17/56 ,  H05K1/03 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/0029 ,  H05K2201/09009 ,  Y10T428/24273

摘要： It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 μm, and a diameter of the through hole is 20 to 100 μm. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 μm in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 μm.

摘要翻译： 提供了绝缘基板，其包括布置在绝缘基板中的导体的通孔。 绝缘基板的厚度为25〜100μm，通孔的直径为20〜100μm。 绝缘基板包括主体部分和暴露于通孔的暴露部分，并且由氧化铝烧结体构成。 氧化铝烧结体的相对密度为99.5％以上。 氧化铝烧结体的纯度为99.9％以上，所述主体部的平均粒径为3〜6μm。 氧化铝颗粒在暴露区域是板形的，板状氧化铝颗粒的平均长度为8至25μm。

公开(公告)号：US20160353564A1

公开(公告)日：2016-12-01

申请号：US14428358

申请日：2015-01-07

申请人： SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO. LTD.

发明人： Hu HE

IPC分类号： H05K1/02 ,  H05K1/05

CPC分类号： H05K1/028 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10553

摘要： The present invention discloses a L-Bending PCB, which comprises a straight portion and a bending portion connecting to the straight portion, the straight portion comprises a metal substrate bottom, an insulation layer, a conductive layer and a protective layer, wherein, the insulation layer is disposed on a partial surface of the metal substrate bottom, the conductive layer is disposed on the insulation layer and the protective layer is disposed on the conductive layer. When improving the heat dissipation o f the L-Bending PCB by in the present invention, retainingly connecting the heat-dispersing element and the metal substrate bottom together, the reliability of the L-Bending PCB is increasing at the same time.

摘要翻译： 本发明公开了一种L弯曲PCB，其包括直线部分和连接到直线部分的弯曲部分，所述直线部分包括金属基底，绝缘层，导电层和保护层，其中绝缘 层设置在金属基板底部的部分表面上，导电层设置在绝缘层上，保护层设置在导电层上。 在本发明中通过L型弯曲PCB的散热改善时，将散热元件和金属基板底部保持连接在一起，L弯曲PCB的可靠性同时增加。

公开(公告)号：US20160212860A1

公开(公告)日：2016-07-21

申请号：US14910915

申请日：2014-07-24

申请人： LG CHEM, LTD.

发明人： Jae Hyun KIM ,  Jae Jin KIM ,  Cheol-Hee PARK ,  Chee-Sung PARK ,  Shin Hee JUN ,  Sang Yun JUNG ,  Han Nah JEONG

IPC分类号： H05K3/18 ,  H05K1/09 ,  H05K1/02 ,  H05K3/02 ,  C23C18/16 ,  C23C18/31

CPC分类号： C23C18/31 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2053 ,  C23C18/2073 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/02 ,  C25D5/56 ,  H05K1/0296 ,  H05K1/09 ,  H05K3/02 ,  H05K3/181 ,  H05K2201/09009

摘要： Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon.The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

摘要翻译： 提供一种通过简单的方法直接辐射能够在各种聚合物树脂产品或树脂层上形成精细导电图案的电磁波形成导电图案的方法，即使在聚合物树脂本身中也不含有特定的无机添加剂，以及 具有形成在其上的导电图案的树脂结构。 通过电磁波的直接辐射形成导电图案的方法包括：通过在聚合物树脂基板上选择性地辐射电磁波，形成具有预定表面粗糙度的第一区域; 在聚合物树脂基材上形成导电种子; 通过对其上形成有导电种子的聚合物树脂基板进行电镀而形成金属层; 以及从所述聚合物树脂基板的第二区域去除所述导电种子和所述金属层，其中所述第二区域的表面粗糙度小于所述第一区域的表面粗糙度。