公开(公告)号：US12156332B2

公开(公告)日：2024-11-26

申请号：US17914496

申请日：2021-03-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Joo Young Lee ,  Sang Ah Lee ,  Yong Seok Cho

IPC: H05K1/02 ,  H01G9/008 ,  H01G9/12 ,  H01G9/14 ,  H01G9/26 ,  H01G11/10 ,  H01G11/16 ,  H01G11/18 ,  H01G11/74 ,  H01G11/76 ,  H01G11/82 ,  H01M50/209 ,  H01M50/284 ,  H02J7/00 ,  H02J7/14 ,  H05K1/14

Abstract: A cell balancing module according to an embodiment of the present invention comprises: a main board on which a plurality of cell balancing resistors are mounted; at least one sub-board on which a plurality of cell balancing resistors are mounted and which is formed above the main board while being spaced a predetermined distance apart therefrom; and at least one connector which supports the sub-board to be spaced apart from the main board and electrically connects the sub-board to the main board.

公开(公告)号：US12197112B2

公开(公告)日：2025-01-14

申请号：US18010860

申请日：2021-06-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Ah Lee ,  Joo Young Lee ,  Yong Seok Cho

IPC: G03B17/55 ,  G03B30/00 ,  H04N5/222 ,  H04N23/51

Abstract: A camera module comprises: a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing, wherein the shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.

公开(公告)号：US12300917B2

公开(公告)日：2025-05-13

申请号：US17758197

申请日：2020-12-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Joo Young Lee ,  Sang Ah Lee ,  Yong Seok Cho

IPC: H01R12/52 ,  H01R4/02 ,  H05K1/02 ,  H01R4/30 ,  H05K1/18

Abstract: Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.