公开(公告)号：US20230309235A1

公开(公告)日：2023-09-28

申请号：US18021974

申请日：2021-08-17

申请人： LG INNOTEK CO., LTD.

发明人： Suk Ho KIM ,  Sang Hyuck NAM ,  Seok Jun HONG

IPC分类号： H05K1/18 ,  H04N25/77 ,  H04N25/20

CPC分类号： H05K1/182 ,  H04N25/77 ,  H04N25/20 ,  G02B5/208

摘要： A camera module according to an embodiment includes a printed circuit board; an infrared filter disposed on an upper surface of the printed circuit board; and an image sensor disposed under a lower surface of the printed circuit board, wherein the printed circuit board includes: an insulating layer including a cavity overlapping at least a part of the infrared filter and at least a part of the image sensor in an optical axis direction; and a circuit pattern buried in the insulating layer and connected to a terminal of the image sensor; and wherein a shape of the cavity is different from a shape of the image sensor.