公开(公告)号：US20190049760A1

公开(公告)日：2019-02-14

申请号：US16078562

申请日：2017-02-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Han HYUN ,  Hyun Joon KIM ,  Jae Seok PARK ,  Kum Tae LEE

IPC: G02F1/1335 ,  H01L33/50 ,  H01L33/52 ,  H05B33/14 ,  H05B37/02

Abstract: An embodiment relates to a light emitting module, a light emitting module manufacturing method, a light emitting cabinet, and a display device. The display device of an embodiment includes: a support frame; and a plurality of light emitting cabinets including a plurality of light emitting modules disposed on the support frame, wherein the plurality of light emitting modules may include a substrate, a plurality of light emitting units directly mounted on the substrate, and a black matrix disposed on the substrate to surround each of the plurality of light emitting units. The embodiment may implement uniform color and uniform brightness by providing a light emitting module providing full color, and may implement slimness and high brightness by simplifying a configuration of the light emitting module in a chip on board (COB) type. The embodiment may implement low power driving and improve productivity and yield by simplifying the configuration of the light-emitting module.