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公开(公告)号:US11888000B2
公开(公告)日:2024-01-30
申请号:US17470178
申请日:2021-09-09
申请人: LG INNOTEK CO., LTD.
IPC分类号: H01L27/144 , H01L31/107 , H01L27/146 , H01L31/02 , G01J1/44 , H01C7/00
CPC分类号: H01L27/1446 , G01J1/44 , H01L31/02027 , H01L31/107 , G01J2001/448 , G01J2001/4466 , H01C7/006 , H01L27/14609
摘要: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.
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2.
公开(公告)号:US11961870B2
公开(公告)日:2024-04-16
申请号:US17670176
申请日:2022-02-11
申请人: LG INNOTEK CO., LTD.
发明人: Brian Piccione , Mark Itzler , Xudong Jiang , Krystyna Slomkowski , Harold Y. Hwang , John L. Hostetler
IPC分类号: H01L27/14 , H01L27/146
CPC分类号: H01L27/14665 , H01L27/1463 , H01L27/14685 , H01L27/14694
摘要: Devices, systems, and methods are provided for reducing electrical and optical crosstalk in photodiodes. A photodiode may include a first layer with passive material, the passive material having no electric field. The photodiode may include a second layer with an absorbing material, the second layer above the first layer. The photodiode may include a diffused region with a buried p-n junction. The photodiode may include an active region with the buried p-n junction and having an electric field greater than zero. The photodiode may include a plateau structure based on etching through the second layer to the first layer, the etching performed at a distance of fifteen microns or less from the buried p-n junction.
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公开(公告)号:US12125857B2
公开(公告)日:2024-10-22
申请号:US17581464
申请日:2022-01-21
申请人: LG INNOTEK CO., LTD.
IPC分类号: H01L27/144 , G01J1/44 , H01L31/02 , H01L31/107 , H01C7/00 , H01L27/146
CPC分类号: H01L27/1446 , G01J1/44 , H01L31/02027 , H01L31/107 , G01J2001/4466 , G01J2001/448 , H01C7/006 , H01L27/14609
摘要: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.
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