公开(公告)号：US20220078906A1

公开(公告)日：2022-03-10

申请号：US17446541

申请日：2021-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Joon KIM ,  Yong Hyun GWON ,  Yong Hyun CHO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  G06K9/00 ,  G06K19/07

Abstract: A circuit board according to an embodiment includes: a substrate including one surface and the other surface; a first circuit pattern disposed on the one surface; and a second circuit pattern disposed on the other surface, wherein at least one via is formed in the substrate, and the first circuit pattern and the second circuit pattern are wire-bonded through the via to conduct electricity.