Sputtering system
    1.
    发明申请
    Sputtering system 失效
    溅射系统

    公开(公告)号:US20020170822A1

    公开(公告)日:2002-11-21

    申请号:US10076097

    申请日:2002-02-15

    Inventor: Soo Chang Chang

    CPC classification number: H01J37/3402 C23C14/35

    Abstract: A sputtering system for depositing a thin film on a substrate includes a vacuum chamber, a support for supporting the substrate in the vacuum chamber, a target arranged to oppose the support, a fixed plate formed on a first side of the target, and a plurality of electromagnets formed on the fixed plate in a cell pattern.

    Abstract translation: 用于在衬底上沉积薄膜的溅射系统包括真空室,用于在真空室中支撑衬底的支撑体,与支撑体相对布置的靶,形成在靶的第一侧上的固定板,以及多个 以电池图案形成在固定板上的电磁体。

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