公开(公告)号：US10299046B2

公开(公告)日：2019-05-21

申请号：US15335742

申请日：2016-10-27

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Hsien-Ken Liao ,  Ming-Te Tu ,  Jyong-Yue Tian ,  Yao-Ting Yeh

IPC: H04R25/00 ,  H04R19/04 ,  B81B7/00 ,  H04R1/04 ,  B81C1/00

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.

公开(公告)号：US10362406B2

公开(公告)日：2019-07-23

申请号：US15334773

申请日：2016-10-26

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Yao-Ting Yeh ,  Hsien-Ken Liao ,  Jyong-Yue Tian ,  Ming-Te Tu

IPC: H04R19/01 ,  H04R19/04 ,  B81B7/00 ,  H04R19/00 ,  B81C1/00 ,  H04R17/02 ,  H04R31/00

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.

公开(公告)号：US10362377B2

公开(公告)日：2019-07-23

申请号：US15334655

申请日：2016-10-26

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Hsien-Ken Liao ,  Ming-Te Tu ,  Jyong-Yue Tian ,  Yao-Ting Yeh

IPC: H04R1/04 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end of the sidewall and defining a chamber therein and having a solder pad and a fifth contact in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted on the substrate inside the chamber and electrically connected to the first conduction part and the second conduction part, and a acoustic wave sensor mounted on the substrate inside the chamber to face toward the sound hole and electrically connected to the first conduction part using flip-chip technology.