公开(公告)号：US20230194808A1

公开(公告)日：2023-06-22

申请号：US17927755

申请日：2021-06-17

Applicant: LINKTEL TECHNOLOGIES CO., LTD.

Inventor： Baiquan HU ,  Xuefeng LIN ,  Linke LI ,  Tianshu WU ,  Xianwen YANG ,  Jian ZHANG

IPC: G02B6/42

CPC classification number: G02B6/4246 ,  G02B6/42 ,  G02B6/4269 ,  G02B6/4207 ,  G02B6/428

Abstract: A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.