公开(公告)号：US09754811B2

公开(公告)日：2017-09-05

申请号：US14423144

申请日：2013-08-22

申请人： LINTEC CORPORATION

发明人： Naoya Saeki ,  Tomonori Shinoda ,  Ken Takano

IPC分类号： H01L21/68 ,  H01L21/683 ,  C09J163/00 ,  C09J7/02 ,  H01L21/78 ,  H01L23/544

CPC分类号： H01L21/6836 ,  C09J7/0228 ,  C09J7/22 ,  C09J7/38 ,  C09J7/401 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/1471 ,  H01L2924/00

摘要： [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.

公开(公告)号：US20150228526A1

公开(公告)日：2015-08-13

申请号：US14423144

申请日：2013-08-22

申请人： LINTEC CORPORATION

发明人： Naoya Saeki ,  Tomonori Shinoda ,  Ken Takano

IPC分类号： H01L21/683 ,  C09J7/02 ,  H01L21/78

CPC分类号： H01L21/6836 ,  C09J7/0228 ,  C09J7/22 ,  C09J7/38 ,  C09J7/401 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  Y10T428/1471 ,  H01L2924/00

摘要： [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.

摘要翻译： 为了提供具有保护膜形成层的切割片，可以容易地制造具有均匀性和印刷精度高的保护膜的半导体芯片，使得保护膜和切割片的剥离可以是 容易实现，并且在切割期间具有优异的芯片固定能力。 [解决方案]具有保护膜形成层的切割片的特征在于保护膜形成层可剥离地设置在由粘合剂层形成的粘合剂层的粘合剂层上，该粘合剂层含有粘合剂成分和含游离环氧基的化合物 ，被层压到基底膜上。