公开(公告)号：US10553766B2

公开(公告)日：2020-02-04

申请号：US16084453

申请日：2017-03-07

申请人： LUMILEDS HOLDING B.V.

发明人： Norbertus Antonius Maria Sweegers ,  Floris Maria Hermansz Crompvoets ,  Christian Kleijnen ,  Gerard Kums

IPC分类号： H01L33/54 ,  H01L25/075

摘要： The invention describes a method of manufacturing an LED module, comprising the steps of providing a translucent encapsulant comprising a number of layers to enclose a number of LEDs of the LED module; modifying the surface structure of an outer surface of a layer to form at least one dense scattering region corresponding to the position of an LED of the LED module; to form at least one sparse scattering region that does not correspond to the position of an LED of the LED module; and to form a transition scattering region between a dense scattering region and a sparse scattering region. The invention further describes an LED module, and a device comprising a device housing and at least one such LED module.