公开(公告)号：US20130215570A1

公开(公告)日：2013-08-22

申请号：US13654885

申请日：2012-10-18

申请人： LUNG-CHI HUANG ,  CHIH-HAO YANG

发明人： LUNG-CHI HUANG ,  CHIH-HAO YANG

IPC分类号： G06F1/20

CPC分类号： G06F1/203 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20727 ,  H01L2924/00

摘要： An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.

摘要翻译： 电子设备包括底盘和散热模块。 底盘包括第一面板，基本上平行于第一面板的第二面板和附接在第一面板上并位于第一面板和第二面板之间的母板。 所述散热模块安装在所述主板上并且包括具有盖的风扇，附接到所述风扇的第一侧的第一散热片组件和附接到所述风扇的第二侧的第二散热片组件。 所述盖包括具有开口的主板和从所述开口的边缘倾斜延伸的阻力凸缘。 第一翅片组件的一部分由开口暴露。 抵抗法兰抵抗第二面板以使主板远离第二面板。