公开(公告)号：US09790582B2

公开(公告)日：2017-10-17

申请号：US14697454

申请日：2015-04-27

Applicant: Lam Research Corporation

Inventor： Chin-Yi Liu ,  Russell Ormond ,  Nash W. Anderson ,  David M. Schaefer

IPC: B32B15/04 ,  C23C4/134 ,  H01L21/66 ,  H01L21/67 ,  C23C4/11 ,  C23C4/06 ,  H01J37/32

CPC classification number: C23C4/134 ,  C23C4/06 ,  C23C4/11 ,  H01J37/32477 ,  H01J37/32495 ,  H01J37/32972 ,  H01J37/3299 ,  H01L21/67069 ,  H01L21/67253 ,  H01L22/10

Abstract: In accordance with this disclosure, there are provided several inventions, including a substrate processing apparatus with multi-layer surfaces configured to face the plasma and resist against corrosion. These multi-layer surfaces may in one example include a base layer of aluminum, anodized aluminum, or quartz, a second layer of stabilized zirconia, and a second layer of a yttrium-aluminum composite such as yttrium aluminum garnet (YAG).