公开(公告)号：US20020123298A1

公开(公告)日：2002-09-05

申请号：US10136600

申请日：2002-04-30

Applicant: Lam Research Corporation

Inventor： Wilbur Krusell ,  Glenn Travis ,  Erik Engdahl ,  James Bagley

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B021/00

CPC classification number: B24B37/245 ,  B24B21/04 ,  B24B37/26

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract translation: 公开了一种用于化学机械平面化半导体晶片的设备，其具有连续的抛光带，第一侧具有固定的研磨表面和与第一侧相对的第二侧。 在一个实施例中，第一驱动辊保持抛光条的第一端，第二驱动辊保持抛光条的第二端，并且一对支撑辊在抛光的任一端接触抛光条的第二侧 带支撑。 驱动马达可操作地连接到第一和第二驱动辊，用于以线性双向的方式移动抛光条。