公开(公告)号：US09818633B2

公开(公告)日：2017-11-14

申请号：US14517623

申请日：2014-10-17

Applicant: Lam Research Corporation

Inventor： Thorsten Lill ,  Vahid Vahedi ,  Candi Kristoffersen ,  Andrew D. Bailey, III ,  Meihua Shen ,  Rangesh Raghavan ,  Gary Bultman

IPC: H01L21/677

CPC classification number: H01L21/67745 ,  H01L21/67766

Abstract: An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port.

公开(公告)号：US20160111309A1

公开(公告)日：2016-04-21

申请号：US14517623

申请日：2014-10-17

Applicant: Lam Research Corporation

Inventor： Thorsten Lill ,  Vahid Vahedi ,  Candi Kristoffersen ,  Andrew D. Bailey, III ,  Meihua Shen ,  Rangesh Raghavan ,  Gary Bultman

IPC: H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/673

CPC classification number: H01L21/67745 ,  H01L21/67766

Abstract: An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port.

Abstract translation: 用于将晶片转移到晶片处理模块和从晶片处理模块传送晶片的EFEM包括具有由前壁，后壁，第一和第二侧壁，顶壁和底壁限定的受控环境的外壳。 第一侧壁和第二侧壁包括两个或更多个晶片负载端口，其中每个晶片负载端口适于接收FOUP。 前壁包括被配置为附接到可操作以允许将晶片转移到前壁群集处理工具的相应负载锁的晶片端口。 后壁包括适于与后壁群集处理工具处于操作关系的晶片端口。 EFEM外壳中的机器人可操作以通过晶片加载端口，第一前壁晶片端口，第二前壁晶圆端口和后壁晶圆端口传送晶片。