公开(公告)号：US20050082352A1

公开(公告)日：2005-04-21

申请号：US10605673

申请日：2003-10-16

申请人： Lannie Bolde ,  Jac Burke ,  Kevin Gallagher ,  Howard Hutchinson ,  Juan Jeri

发明人： Lannie Bolde ,  Jac Burke ,  Kevin Gallagher ,  Howard Hutchinson ,  Juan Jeri

IPC分类号： B23K1/018 ,  B23K31/02

CPC分类号： B23K1/018 ,  B23K2101/40

摘要： A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply a loading force to the semiconductor device. The assembly of the substrate and the semiconductor device are loaded into the fixture with the shearing element proximate the semiconductor device, and heating the solder connections of the assembly in the fixture are heated proximate the substrate to a predetermined temperature by applying a heat source to a surface of the substrate distal from the semiconductor device.

摘要翻译： 一种用剪切元件将夹具中的半导体器件与衬底分离的方法和装置，其中半导体器件通过焊接连接件附接到衬底以形成组件，包括使用剪切元件向半导体施加加载力 设备。 将衬底和半导体器件的组件装载到具有剪切元件靠近半导体器件的固定装置中，并且将固定装置中的组件的焊接连接件加热到基板附近加热到预定温度，通过将热源施加到 衬底远离半导体器件的表面。