COMPOSITE ELECTROLESS PLATING
    7.
    发明申请
    COMPOSITE ELECTROLESS PLATING 审中-公开
    复合电镀镀层

    公开(公告)号:US20090011136A1

    公开(公告)日:2009-01-08

    申请号:US12212898

    申请日:2008-09-18

    IPC分类号: B05D1/18

    摘要: This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.

    摘要翻译: 本发明涉及一种用于对物品进行无电镀金属化以及镀浴和随后镀覆的基底的方法。 该方法包括使制品的表面与基本上不含有毒和/或重金属的无电镀金属浴接触。