公开(公告)号：US20190184869A1

公开(公告)日：2019-06-20

申请号：US15848428

申请日：2017-12-20

Applicant: Lear Corporation

Inventor： Ashford Allen Galbreath ,  Arjun Yetukuri ,  Paul Olivier ,  Colin Andrew Paton-Phillips ,  David Gallagher

IPC: B60N2/56 ,  B60H1/00

Abstract: A vehicle trim assembly comprises a foam bun, an electrically insulative top finish layer above the foam bun, a thermal gradient assembly under the finish trim layer, and a thermal enhancement layer between the thermal gradient assembly and the finish trim layer. The thermal gradient assembly is adapted to generate a thermal gradient when receiving an electric current and has an electrically conductive top layer, an electrically conductive bottom layer, and a semiconductor layer having first and second semiconductor regions between the top and bottom layers. The thermal enhancement layer has a thermal conductivity adapted to direct thermal energy transfer between the thermal gradient assembly and the finish trim layer.

公开(公告)号：US10759312B2

公开(公告)日：2020-09-01

申请号：US15848428

申请日：2017-12-20

Applicant: Lear Corporation

Inventor： Ashford Allen Galbreath ,  Arjun Yetukuri ,  Paul Olivier ,  Colin Andrew Paton-Phillips ,  David Gallagher

IPC: F25B21/00 ,  F25B21/02 ,  F25B21/04 ,  B60N2/58 ,  B60N2/56 ,  B60H1/00

Abstract: A vehicle trim assembly comprises a foam bun, an electrically insulative top finish layer above the foam bun, a thermal gradient assembly under the finish trim layer, and a thermal enhancement layer between the thermal gradient assembly and the finish trim layer. The thermal gradient assembly is adapted to generate a thermal gradient when receiving an electric current and has an electrically conductive top layer, an electrically conductive bottom layer, and a semiconductor layer having first and second semiconductor regions between the top and bottom layers. The thermal enhancement layer has a thermal conductivity adapted to direct thermal energy transfer between the thermal gradient assembly and the finish trim layer.