公开(公告)号：US5364225A

公开(公告)日：1994-11-15

申请号：US901042

申请日：1992-06-19

申请人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  by Ellen Sulgar, executrix ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

发明人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  by Ellen Sulgar, executrix ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

IPC分类号： B23P21/00 ,  B25H3/02 ,  B65D51/14 ,  B65D85/86 ,  B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H05K3/00 ,  B65G65/02 ,  C23C13/08

CPC分类号： H01L21/67236 ,  H01L21/67126 ,  H01L21/67363 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67772 ,  Y10S414/139

摘要： Disclosed is a method of manufacturing a printed circuit panel. The method is carried out without a cleanroom, but in a clean room environment. The first step is to place a thin, non-rigid panel in a suitable fixture, for example, for transfer and also for processing. The fixtured panel is then placed in an air tight transfer container, which has a substantially contaminant free atmosphere. The transfer container has a sealed door at one end. The transfer container is then brought into a seaiable, substantially airtight interlock with a process enclosure. This process enclosure also has a substantially contaminant free atmosphere, and a sealed door at one end. An airtight seal is formed between the transfer container and the process enclosure, and also between the surfaces of the two doors. This is to avoid introducing surface contaminants into the process enclosure and transfer container atmospheres. Next, the two doors are opened simultaneously. This is to allow the transfer of at least one panel and its fixture from the transfer container into the process enclosure. Inside the process enclosure the panel is transferred to a process station for a manufacturing process. Finally, the panel and its fixture are transferred from the process enclosure into the transfer container. This may be the same container or a different container. The doors of the process enclosure and the transfer container are then closed and sealed.

摘要翻译： 公开了印刷电路板的制造方法。 该方法在没有洁净室的情况下进行，但在洁净室环境中进行。 第一步是将薄的非刚性面板放置在合适的夹具中，例如用于转移和加工。 然后将固定面板放置在气密转移容器中，其具有基本上无污染的气氛。 转移容器在一端具有密封门。 然后将转移容器与过程外壳进入可检测的，基本上气密的互锁。 该过程外壳还具有基本上无污染的气氛，并且在一端具有密封门。 在转移容器和处理外壳之间以及两个门的表面之间形成气密密封。 这是为了避免将表面污染物引入工艺外壳并转移容器环境。 接下来，两扇门同时打开。 这是为了允许将至少一个面板及其固定装置从转移容器传送到过程外壳中。 在工艺外壳内部，面板被传送到制造过程的处理站。 最后，面板及其固定装置从过程外壳转移到转移容器中。 这可能是相同的容器或不同的容器。 然后将过程外壳和转移容器的门关闭​​并密封。