公开(公告)号：US5364225A

公开(公告)日：1994-11-15

申请号：US901042

申请日：1992-06-19

申请人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  by Ellen Sulgar, executrix ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

发明人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  by Ellen Sulgar, executrix ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

IPC分类号： B23P21/00 ,  B25H3/02 ,  B65D51/14 ,  B65D85/86 ,  B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H05K3/00 ,  B65G65/02 ,  C23C13/08

CPC分类号： H01L21/67236 ,  H01L21/67126 ,  H01L21/67363 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67772 ,  Y10S414/139

摘要： Disclosed is a method of manufacturing a printed circuit panel. The method is carried out without a cleanroom, but in a clean room environment. The first step is to place a thin, non-rigid panel in a suitable fixture, for example, for transfer and also for processing. The fixtured panel is then placed in an air tight transfer container, which has a substantially contaminant free atmosphere. The transfer container has a sealed door at one end. The transfer container is then brought into a seaiable, substantially airtight interlock with a process enclosure. This process enclosure also has a substantially contaminant free atmosphere, and a sealed door at one end. An airtight seal is formed between the transfer container and the process enclosure, and also between the surfaces of the two doors. This is to avoid introducing surface contaminants into the process enclosure and transfer container atmospheres. Next, the two doors are opened simultaneously. This is to allow the transfer of at least one panel and its fixture from the transfer container into the process enclosure. Inside the process enclosure the panel is transferred to a process station for a manufacturing process. Finally, the panel and its fixture are transferred from the process enclosure into the transfer container. This may be the same container or a different container. The doors of the process enclosure and the transfer container are then closed and sealed.

摘要翻译： 公开了印刷电路板的制造方法。 该方法在没有洁净室的情况下进行，但在洁净室环境中进行。 第一步是将薄的非刚性面板放置在合适的夹具中，例如用于转移和加工。 然后将固定面板放置在气密转移容器中，其具有基本上无污染的气氛。 转移容器在一端具有密封门。 然后将转移容器与过程外壳进入可检测的，基本上气密的互锁。 该过程外壳还具有基本上无污染的气氛，并且在一端具有密封门。 在转移容器和处理外壳之间以及两个门的表面之间形成气密密封。 这是为了避免将表面污染物引入工艺外壳并转移容器环境。 接下来，两扇门同时打开。 这是为了允许将至少一个面板及其固定装置从转移容器传送到过程外壳中。 在工艺外壳内部，面板被传送到制造过程的处理站。 最后，面板及其固定装置从过程外壳转移到转移容器中。 这可能是相同的容器或不同的容器。 然后将过程外壳和转移容器的门关闭​​并密封。

公开(公告)号：US5451131A

公开(公告)日：1995-09-19

申请号：US901041

申请日：1992-06-19

申请人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

发明人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

IPC分类号： H01L21/02 ,  F24F7/06 ,  H01L21/00 ,  H01L21/677 ,  B65G1/00 ,  B23B29/24 ,  B65G65/34 ,  C23C14/00

CPC分类号： H01L21/67236 ,  H01L21/67126 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14 ,  Y10T29/53191

摘要： Disclosed is a manufacturing system having isolated islands of "clean room" environment connected by inter-process transfer containers for transfering in-process workpieces. The system has airlock transfer ports between the process enclosures and the inter-process transfer containers. The make and break airlock transfer ports have facing sealable doors in the process enclosure and the transfer container. These doors are in air sealable facing recesses of the process enclosure and the transfer container. At least one peripheral gasket surrounds the recesses and the pair of doors. This provides a substantially clean room environment in the airlock. The sealable door in the interprocess transfer container is fabricated of a ferromagnetic material and is seated on a ferromagnetic gasket, while the sealable door in the process enclosure has a controllable electromagnetic clamp. After establishment of an airtight seal between the two recesses, the doors are opened by activating the electromagnetic clamp in the process enclosure door to pull the ferromagnetic door in the interprocess transfer container away from the ferromagnetic gasket. The results in the simultaneous opening of the of the process enclosure door and the ferromagnetic interprocess transfer container door, while avoiding contamination inside either of the containers.

摘要翻译： 公开了一种具有通过过程间转移容器连接的隔离岛“洁净室”环境的制造系统，用于转移过程中的工件。 该系统在进程外壳和进程间转移容器之间具有气闸传送端口。 制造和拆卸气闸传输端口在处理外壳和转移容器中具有面对的可密封的门。 这些门在处理外壳和转移容器的空气密封面对的凹部中。 至少一个外围垫圈围绕凹槽和一对门。 这在气闸中提供了基本洁净的房间环境。 处理间转移容器中的可密封的门由铁磁材料制成并且位于铁磁性垫圈上，而过程外壳中的可密封的门具有可控的电磁夹。 在两个凹口之间建立密封密封之后，通过启动过程外壳门中的电磁夹具来打开门，以将处理间转移容器中的铁磁门拉离铁磁垫圈。 结果是同时打开过程外壳门和铁磁过程转移容器门，同时避免了任何一个容器内的污染。

公开(公告)号：US5395198A

公开(公告)日：1995-03-07

申请号：US901640

申请日：1992-06-19

申请人： Thomas P. Duffy ,  Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

发明人： Thomas P. Duffy ,  Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

IPC分类号： B23P21/00 ,  B25H3/02 ,  B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/683 ,  H05K3/00 ,  B65G49/06 ,  B65H1/00 ,  C23C16/00

CPC分类号： H01L21/67236 ,  H01L21/67126 ,  H01L21/67363 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67772

摘要： Disclosed is a system for handling large area, in-process, circuit panel layers. The circuit panel layers are thin and flimsy, and require rigid support for certain processing steps. The system includes a peripheral frame fixture for surrounding and supporting the in process circuit panel layer, and a a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The peripheral frame fixture includes a bottom plate having a central opening to expose the circuit panel layer, a top frame having a corresponding central opening to expose the opposite surface of the circuit panel layer, and a compressive apparatus, as screws, bolts, or the like, for applying a z axis compressive force to the bottom plate, the top frame, and a panel layer therebetween. Optionally, the fixture may include alignment pins or fiducials for aligning the bottom plate, a panel layer, and the top frame, and a robotic interface for a robotic arm to grasp and transfer the peripheral frame fixture. The system also includes a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The loading chuck includes a peripheral edge for receiving the bottom plate of the peripheral frame fixture. This provides co-planarity of the in-process circuit panel layer, the bottom plate of the peripheral frame fixture, and the vacuum table. The vacuum table is within the area bounded by the peripheral edge of the loading chuck and the peripheral frame of the peripheral frame fixture, and is coplanar with them. The vacuum table includes slidable bearing surfaces, with vacuum apertures for drawing a vacuum to hold the panel in place, and slide actuators for moving the slidable bearing surfaces to apply x-y axis tension to a panel on the bearing surfaces.

摘要翻译： 公开了一种用于处理大面积，在制程中的电路板层的系统。 电路板层薄而脆弱，并且对于某些加工步骤需要刚性支撑。 该系统包括用于围绕和支撑过程电路板层的外围框架固定装置，以及用于将工艺中电路板层安装在周边框架固定装置中的装载卡盘。 外围框架固定装置包括具有中央开口以暴露电路板层的底板，具有相应中心开口以露出电路板层的相对表面的顶部框架，以及压缩装置，如螺钉，螺栓或 用于将z轴压缩力施加到底板，顶部框架以及它们之间的面板层。 可选地，固定装置可以包括用于对准底板，面板层和顶部框架的对准销或基准，以及用于机器人臂来抓握和传送外围框架固定装置的机器人界面。 该系统还包括用于将工艺中电路板层安装在外围框架固定装置中的装载卡盘。 装载卡盘包括用于接收外围框架固定装置的底板的外围边缘。 这提供了工艺电路板层，外围框架固定装置的底板和真空工作台的共面性。 真空工作台位于由装载卡盘周边边缘和外围框架固定装置的外围框架所限定的区域内，与它们共面。 真空工作台包括可滑动的支承表面，具有用于拉伸真空以将面板保持在适当位置的真空孔，以及用于移动可滑动的支承表面以将x-y轴张力施加到支承表面上的面板的致动器。

公开(公告)号：US5339952A

公开(公告)日：1994-08-23

申请号：US901479

申请日：1992-06-19

申请人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

发明人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

IPC分类号： H01L21/677 ,  B65D51/14 ,  B65D85/86 ,  B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  B65D73/02 ,  B65D85/42

CPC分类号： H01L21/67363 ,  H01L21/67386

摘要： Disclosed is a transfer container for carrying circuit panels in and between substantially contaminant free environments. The walls of the transfer container are fabricated out of substantially particulate free, unfilled polymers, such as polycarbonate. One of the end walls is an access wall. The access wall has an opening surrounded by a ferromagnetic gasket. This gasketed opening is adapted to receive a ferromagnetic door panel. The side walls, and the top and bottom walls may extend beyond the access wall, with the ends of said walls defining a plane, so that the access wall is recessed with respect to the plane defined by the said extensions. Each of the side walls have co-planar bracket pairs for holding circuit panels. Either one of, or preferably both brackets of a bracket pair have pyramidal or conical positioning pins. These pins extend upwardly from the brackets and are adapted to receive and hold a workpiece in place.

摘要翻译： 公开了一种用于在基本无污染环境之间和之间承载电路板的转移容器。 转移容器的壁由基本上不含颗粒的未填充聚合物如聚碳酸酯制成。 其中一个端壁是进入墙。 进入墙具有由铁磁垫圈包围的开口。 该垫圈开口适于容纳铁磁门板。 侧壁和顶壁和底壁可以延伸超过进入壁，其中所述壁的端部限定一个平面，使得进入壁相对于由所述延伸部限定的平面凹陷。 每个侧壁具有用于保持电路板的共面支架对。 托架对中的任何一个或优选地两个支架具有金字塔形或锥形定位销。 这些销钉从支架向上延伸，并适于将工件接收并固定到位。

公开(公告)号：US06756680B2

公开(公告)日：2004-06-29

申请号：US09782471

申请日：2001-02-12

申请人： Miguel A. Jimarez ,  Cynthia S. Milkovich ,  Mark V. Pierson

发明人： Miguel A. Jimarez ,  Cynthia S. Milkovich ,  Mark V. Pierson

IPC分类号： H01L2348

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/10126 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81013 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/0032 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00014

摘要： An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

公开(公告)号：US06699736B2

公开(公告)日：2004-03-02

申请号：US10305643

申请日：2002-11-26

申请人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

发明人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

IPC分类号： H01L2144

CPC分类号： H05K3/0061 ,  H01L21/4846 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10977

摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.

摘要翻译： 用于将金属加强件导电耦合到芯片载体的方法和结构。 衬底在其表面上具有导电焊盘，并且在衬底表面上形成粘合剂层。 金属加强件被放置在粘合剂层上，其中粘合剂层将加强件机械地连接到基底表面，并将加强件电耦合到垫。 然后将粘合剂层固化，例如通过在升高的温度下加压。 本发明的实施例通过在焊盘上形成导电触点并在基板上设置干燥的粘合剂来形成粘合剂层，使得导电触点位于干粘合剂中的孔内。 导电触头将加强件电耦合到焊盘。 固化步骤包括固化干燥粘合剂和导电接触，导致干燥粘合剂将加强剂粘合到基底上。 导电接触可包括导电粘合剂或金属焊料。 本发明的另外的实施方案通过在基底上施加导电粘合剂形成粘合剂层，其中在将加强件放置在粘合剂层上之后，导电粘合剂将加强件机械地和电耦合到基底的表面。

公开(公告)号：US06487461B1

公开(公告)日：2002-11-26

申请号：US09590280

申请日：2000-06-09

申请人： Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

发明人： Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

IPC分类号： G05B1918

CPC分类号： G02F1/13336 ,  Y10S345/903

摘要： A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

摘要翻译： 一种用于对准多个用于构建平板显示器的薄膜晶体管瓦片的方法。 盖板安装在盖板支架上。 接合材料的第一层被施加到每个瓷砖的第一侧中的至少一个以及待固定瓷砖的盖板的表面。 瓦片布置在盖板上，使得第一层粘合材料布置在瓦片和盖板之间。 瓦片连接到对准装置。 瓷砖相对于彼此和盖板对准。 瓦片至少部分地固定到盖板上。

公开(公告)号：US06173887B1

公开(公告)日：2001-01-16

申请号：US09339924

申请日：1999-06-24

申请人： Donald I. Mead ,  Mark V. Pierson

发明人： Donald I. Mead ,  Mark V. Pierson

IPC分类号： B23K2622

CPC分类号： H05K3/3484 ,  B23K1/0053 ,  B23K1/0056 ,  B23K2101/40 ,  H05K3/3494 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/107

摘要： A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. In another embodiment, a reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. In yet another embodiment, a reflective mask with apertures filled with solder paste is applied onto a substrate and then heated to cause localized solder melting. The mask and excess solder paste are removed.

摘要翻译： 一种通过将衬底层施加到衬底上的电路化特征并在该特征上选择性地加热和熔化焊膏以形成焊料凸块来在衬底上形成导电接触的方法。 去除多余的焊膏。 聚焦能量热源如激光束或聚焦红外线加热焊膏。 在另一个实施例中，具有孔的反射掩模可以用于允许聚焦的加热源选择性地熔化施加到电路化特征上的焊膏层的区域。 在另一个实施例中，将具有填充有焊膏的孔的反射掩模施加到基板上，然后加热以引起局部焊料熔化。 去除掩模和多余的焊膏。

公开(公告)号：US5969945A

公开(公告)日：1999-10-19

申请号：US808829

申请日：1997-02-27

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.

摘要翻译： 丝网印刷夹具具有安装在一侧的部件的柔性电路板，以允许将焊膏的图案屏蔽到第二侧上，以便随后将部件附接到该侧。 在电子封装组件中，具有部件的柔性电路板围绕具有空腔的散热器组件缠绕，使得柔性电路板上的至少一个部件位于腔内并与散热器热连接。

公开(公告)号：US5889321A

公开(公告)日：1999-03-30

申请号：US877538

申请日：1997-06-17

申请人： Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson

发明人： Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson

IPC分类号： H01L21/48 ,  H01L21/50 ,  H05K1/18 ,  H01L23/48

CPC分类号： H05K1/189 ,  H01L21/4803 ,  H01L21/50 ,  H01L2224/16225

摘要： A stiffener (34 or 52 or 72) includes a pathway which allows gases and fluids, such as air, to be vented from the interface between surface bonding regions (35 or 60 or 74) of the stiffener and an adhesive (38 or 56 or 80) on a flexible substrate (36 or 54 or 78). The pathway may take the form of a porous material used for the stiffener or one or more bore holes (58 or 59 or 70) formed in the stiffener. The stiffener may also include an internal cavity (76) for promoting venting of fluids and gases. By venting fluid and gases from the adhesive/stiffener interface, better adhesion between the stiffener and flexible substrate is achieved.

摘要翻译： 加强件（34或52或72）包括允许气体和流体（例如空气）从加强件的表面粘合区域（35或60或74）之间的界面和粘合剂（38或56或 80）在柔性基板（36或54或78）上。 该通道可以采用用于加强件的多孔材料的形式或形成在加强件中的一个或多个钻孔（58或59或70）。 加强件还可以包括用于促进流体和气体排放的内腔（76）。 通过从粘合剂/加强件界面排出流体和气体，实现加强件和柔性基材之间更好的粘附。