公开(公告)号：US20150226899A1

公开(公告)日：2015-08-13

申请号：US14563013

申请日：2014-12-08

Applicant: Lextar Electronics Corporation

Inventor： Yin-Cyuan Wu

IPC: F21V8/00

CPC classification number: G02B6/003 ,  G02B6/0023

Abstract: A back light module comprising a light-emitting module, a light transparent refraction plate and a light guide plate is disclosed. The light-emitting module comprises a substrate and several light-emitting components disposed on the substrate. Each light-emitting component has a light-emitting surface. The light transparent refraction plate is disposed on the substrate and has several apertures. Each aperture exposes a corresponding light-emitting surface, and has a sidewall higher than the light-emitting surface. The light guide plate has a lateral light incident surface facing the light-emitting surface and pressing the light transparent refraction plate. The refractive index of the light transparent refraction plate is larger than that of the light guide plate, such that the light emitted by each light-emitting component will enter the light guide plate after passing through the light transparent refraction plate.

Abstract translation: 公开了一种背光模块，其包括发光模块，透光折射板和导光板。 发光模块包括基板和设置在基板上的几个发光部件。 每个发光部件都具有发光面。 光透明折射板设置在基板上并具有多个孔。 每个孔暴露相应的发光表面，并具有高于发光表面的侧壁。 导光板具有面向发光面的横向光入射面并按压透光折射板。 光透射折射板的折射率大于导光板的折射率，使得每个发光部件发出的光在通过透光折射板之后将进入导光板。

公开(公告)号：US10677423B2

公开(公告)日：2020-06-09

申请号：US16214128

申请日：2018-12-09

Applicant: Lextar Electronics Corporation

Inventor： Yin-Cyuan Wu ,  Yu-Chang Wu ,  Yun-Yi Tien

IPC: F21V9/38 ,  F21Y115/10

Abstract: A light emitting device includes a circuit board, light-emitting diodes, an optically clear adhesive layer and a transparent film. The light-emitting diodes are disposed on a surface of the circuit board. The optically clear adhesive layer is disposed on the surface of the circuit board and covers the light-emitting diodes. The transparent film is disposed over a side of the optically clear adhesive layer distant from the circuit board. A hardness of the transparent film is greater than a hardness of the optically clear adhesive layer.