公开(公告)号：US10677423B2

公开(公告)日：2020-06-09

申请号：US16214128

申请日：2018-12-09

Applicant: Lextar Electronics Corporation

Inventor： Yin-Cyuan Wu ,  Yu-Chang Wu ,  Yun-Yi Tien

IPC: F21V9/38 ,  F21Y115/10

Abstract: A light emitting device includes a circuit board, light-emitting diodes, an optically clear adhesive layer and a transparent film. The light-emitting diodes are disposed on a surface of the circuit board. The optically clear adhesive layer is disposed on the surface of the circuit board and covers the light-emitting diodes. The transparent film is disposed over a side of the optically clear adhesive layer distant from the circuit board. A hardness of the transparent film is greater than a hardness of the optically clear adhesive layer.

公开(公告)号：US11906844B2

公开(公告)日：2024-02-20

申请号：US18151403

申请日：2023-01-06

Applicant: Lextar Electronics Corporation

Inventor： Yun-Yi Tien ,  Yu-Chang Wu ,  Yu-Li Chang

IPC: G02F1/13357 ,  G02F1/1335 ,  H01L33/54 ,  H01L33/60 ,  H01L33/00

CPC classification number: G02F1/133603 ,  G02F1/133607 ,  G02F1/133611 ,  G02F1/133614 ,  H01L33/005 ,  H01L33/54 ,  H01L33/60 ,  G02F2202/36 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.

公开(公告)号：US11579486B2

公开(公告)日：2023-02-14

申请号：US17454820

申请日：2021-11-14

Applicant: Lextar Electronics Corporation

Inventor： Yun-Yi Tien ,  Yu-Chang Wu ,  Yu-Li Chang

IPC: G02F1/13357 ,  H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  G02F1/1335

Abstract: The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

公开(公告)号：US20220163849A1

公开(公告)日：2022-05-26

申请号：US17454820

申请日：2021-11-14

Applicant: Lextar Electronics Corporation

Inventor： Yun-Yi Tien ,  Yu-Chang Wu ,  Yu-Li Chang

IPC: G02F1/13357 ,  H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  G02F1/1335

Abstract: The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.